公开(公告)号：US20250070055A1

公开(公告)日：2025-02-27

申请号：US18942743

申请日：2024-11-10

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Fengqun Lang ,  Hui Li ,  Sizhan Zhou ,  Haiyan Liu ,  Huibin Chen ,  Zhen Lv ,  Chunfu HU

IPC: H01L23/58 ,  B60L53/51 ,  H01L23/367 ,  H01L31/02

Abstract: A power module includes a first metal layer-coated substrate, a plurality of chips, and a first connection piece. A first electrode of each chip is electrically connected to a first metal layer of the first metal layer-coated substrate. The first connection piece includes a first main body part and a plurality of first contact parts. A second electrode of each of the plurality of chips is in contact with at least one of the first contact parts. A part of the first main body part is between at least one pair of adjacent first contact parts. A current flowing out from the chip directly flows to the first main body part through the first contact part. The chips are connected in parallel by using the first connection piece.