公开(公告)号：US20250070055A1

公开(公告)日：2025-02-27

申请号：US18942743

申请日：2024-11-10

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Fengqun Lang ,  Hui Li ,  Sizhan Zhou ,  Haiyan Liu ,  Huibin Chen ,  Zhen Lv ,  Chunfu HU

IPC: H01L23/58 ,  B60L53/51 ,  H01L23/367 ,  H01L31/02

Abstract: A power module includes a first metal layer-coated substrate, a plurality of chips, and a first connection piece. A first electrode of each chip is electrically connected to a first metal layer of the first metal layer-coated substrate. The first connection piece includes a first main body part and a plurality of first contact parts. A second electrode of each of the plurality of chips is in contact with at least one of the first contact parts. A part of the first main body part is between at least one pair of adjacent first contact parts. A current flowing out from the chip directly flows to the first main body part through the first contact part. The chips are connected in parallel by using the first connection piece.

公开(公告)号：US20250079387A1

公开(公告)日：2025-03-06

申请号：US18822629

申请日：2024-09-03

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Hui LI ,  Sizhan Zhou ,  Zhaoyue Wang ,  Huibin Chen ,  Huaibin Zhao ,  Junhe Wang ,  Yafei LV

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L25/16 ,  H01L29/417

Abstract: A power module includes: a first metal brazed substrate; a chipset disposed on the first metal brazed substrate, where the chipset includes at least two chips; and a clip, where the clip covers a side, away from the first metal brazed substrate, of the chipset. Each connecting unit is electrically connected to a corresponding chip. Every two adjacent connecting units are connected along a first direction through a body. Each connecting arm is arranged with respect to two adjacent chips in the chipset. The connecting arm is connected to the first metal brazed substrate. A shortest distance between the connecting arm and one of the two adjacent chips is a first shortest distance, a shortest distance between the connecting arm and the other of the two adjacent chips is a second shortest distance. A difference between the first shortest distance and the second shortest distance falls within a preset threshold.