公开(公告)号：US20240200669A1

公开(公告)日：2024-06-20

申请号：US18536558

申请日：2023-12-12

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Linfeng LU ,  Malin LI ,  Hao MENG ,  Tao HUANG

IPC: F16K11/07 ,  B60K11/02 ,  F16K27/00

CPC classification number: F16K11/0716 ,  B60K11/02 ,  F16K27/003 ,  F16K27/042

Abstract: A temperature control system. The temperature control system includes a plurality of liquid pipelines and a multi-port valve. The multi-port valve includes a valve body and a valve core. The valve body has a mounting cavity, and the valve core is mounted in the mounting cavity. The valve body includes a body and a block-shaped additional portion, the mounting cavity is located on the body, and the block-shaped additional portion is attached to at least a part of a side wall of the body. The valve body includes a plurality of vias, and each via penetrates the block-shaped additional portion and a corresponding side wall of the body. Each liquid pipeline is configured to communicate with one via, there is a battery pack on at least one liquid pipeline, and the temperature control system is configured to control a temperature of the battery pack.

公开(公告)号：US20250058601A1

公开(公告)日：2025-02-20

申请号：US18804294

申请日：2024-08-14

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Linfeng LU ,  Quanming LI ,  Ming Fung WONG

IPC: B60H1/00

Abstract: A thermal management integrated module includes a water-side component, a refrigerant component, and a heat exchanger. The water-side component and the refrigerant component are respectively located on two opposite sides of the heat exchanger. The water-side component includes a water path substrate. A plumbing of the water path substrate is configured to accommodate a first medium. The refrigerant component includes a refrigerant substrate. A plumbing of the refrigerant substrate is configured to accommodate a second medium. The heat exchanger is located in a gap space formed by the water path substrate and the refrigerant substrate. Both the plumbing of the water path substrate and the plumbing of the refrigerant substrate communicate with a plumbing of the heat exchanger. The water-side component has a first external connection port. The first external connection port is configured to connect to a water tank in the thermal management system through a coolant hose.