公开(公告)号：US20250058601A1

公开(公告)日：2025-02-20

申请号：US18804294

申请日：2024-08-14

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Linfeng LU ,  Quanming LI ,  Ming Fung WONG

IPC: B60H1/00

Abstract: A thermal management integrated module includes a water-side component, a refrigerant component, and a heat exchanger. The water-side component and the refrigerant component are respectively located on two opposite sides of the heat exchanger. The water-side component includes a water path substrate. A plumbing of the water path substrate is configured to accommodate a first medium. The refrigerant component includes a refrigerant substrate. A plumbing of the refrigerant substrate is configured to accommodate a second medium. The heat exchanger is located in a gap space formed by the water path substrate and the refrigerant substrate. Both the plumbing of the water path substrate and the plumbing of the refrigerant substrate communicate with a plumbing of the heat exchanger. The water-side component has a first external connection port. The first external connection port is configured to connect to a water tank in the thermal management system through a coolant hose.