公开(公告)号：US20240064893A1

公开(公告)日：2024-02-22

申请号：US18450537

申请日：2023-08-16

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Wei TAO ,  Yuchuan WANG ,  Qingguo TANG ,  Wutao LIU ,  Shuguang XU

IPC: H05K1/02 ,  H05K1/18 ,  H05K5/02

CPC classification number: H05K1/0263 ,  H05K1/18 ,  H05K5/02 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/10272 ,  H05K2201/10553 ,  H05K2201/1059

Abstract: A circuit board assembly includes a circuit board and a conductive plate. The circuit board includes a substrate and a conductive trace. The conductive trace is disposed on the substrate. The conductive plate is fastened in a first region of the circuit board, and a current-carrying capacity of the conductive plate is greater than that of the conductive trace. In the circuit board assembly, the conductive plate capable of carrying a relatively large operating current is provided to significantly improve a current-carrying capability of the circuit board assembly; and the conductive plate and the circuit board are manufactured separately, and then, the conductive plate is disposed in the first region of the circuit board, to implement a fastened connection between the conductive plate and the circuit board. Therefore, manufacturing costs and process difficulty are reduced, and low-cost and batch manufacturing is implemented.