-
公开(公告)号:US20190006077A1
公开(公告)日:2019-01-03
申请号:US16102039
申请日:2018-08-13
发明人: James E. Quilici
IPC分类号: H01F17/00 , H05K3/46 , H05K3/04 , H05K1/02 , H01F41/064 , H01F5/00 , H01F17/06 , H01F41/02 , H01F27/24 , H01F27/28 , H01F41/04 , H05K1/16 , H01F27/02 , H05K3/00
CPC分类号: H01F17/0033 , H01F5/00 , H01F17/062 , H01F27/027 , H01F27/24 , H01F27/2804 , H01F27/2895 , H01F41/02 , H01F41/0206 , H01F41/041 , H01F41/042 , H01F41/064 , H01F2027/2809 , H01F2027/2814 , H05K1/0284 , H05K1/165 , H05K3/0014 , H05K3/045 , H05K3/4611 , H05K2201/086 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , Y10T29/4902 , Y10T29/49073 , Y10T29/49075 , Y10T156/10
摘要: Disclosed are apparatus and methods for arrayed embedded magnetic components that include magnetic devices that have a core that is embedded between two or more substrates and a winding pattern surrounding the core that is implemented on and through the two or more substrates. The winding pattern is operable to induce a magnetic flux within the core when energized by a time varying voltage potential. The winding pattern may be implemented by printed circuit layers, plated vias, other electrically conductive elements, and combinations thereof. Arrayed embedded magnetic components include two or more electrically interconnected magnetic devices positioned side-by-side in a horizontal integration, positioned top-to-bottom in a vertical integration, or combinations thereof. The magnetic devices may have a magnetic functionality such as, but not limited to, a transformer, inductor, and filter. Disclosed magnetic components and methods provide for low cost construction, consistent performance, and a low profile form, among other benefits.
-
公开(公告)号:US10043960B2
公开(公告)日:2018-08-07
申请号:US13296812
申请日:2011-11-15
IPC分类号: H01L33/08 , H01L33/38 , H01L33/62 , H01L33/60 , H01L33/20 , H01L25/075 , H01L33/64 , H01L23/373 , H05K1/03 , H05K1/02 , H05K3/06 , H05K3/16
CPC分类号: H01L33/62 , H01L23/3735 , H01L25/0753 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2924/12032 , H05K1/0269 , H05K1/0306 , H05K3/06 , H05K3/16 , H05K2201/0338 , H05K2201/09036 , H05K2201/09227 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要: Light emitting diode (LED) packages and methods are disclosed herein. In one aspect, a light emitting package is disclosed. The light emitting package includes one or more areas of conductive material having a thickness of less than approximately 50 microns (μm). The package can further include at least one light emitting diode (LED) electrically connected to the conductive material and at least one thin gap disposed between areas of conductive material.
-
公开(公告)号:US20180192518A1
公开(公告)日:2018-07-05
申请号:US15907366
申请日:2018-02-28
发明人: Yoshihito OTSUBO , Masaaki MINAMI
CPC分类号: H05K1/142 , B23K20/10 , B29C65/08 , B29C65/081 , B29C66/1282 , B29C66/12841 , B29C66/43 , B29C66/71 , B29C66/72321 , B29C66/73161 , B29C66/73921 , B29C66/742 , B29C66/81419 , B29C66/8322 , B29K2705/02 , B29K2995/0072 , B29K2995/0074 , B29L2031/3425 , B32B15/08 , B32B2457/08 , H05K1/0313 , H05K1/117 , H05K1/147 , H05K3/328 , H05K3/36 , H05K3/368 , H05K2201/0129 , H05K2201/0195 , H05K2201/0338 , H05K2201/09036 , H05K2203/0278 , H05K2203/0285 , Y10T428/19 , B29K2067/003
摘要: A resin board structure includes a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, and a second member including a second metal film. The first and second metal films are bonded together, and at least a portion the first metal film and at least a portion of the second metal film overlap each other. The first and second metal films are metallurgically bonded at an interface between the first metal film and the second metal film. The first member includes a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other, and the first junction resin covering portion includes an uneven surface to reduce or prevent slippage due to ultrasonic vibration.
-
公开(公告)号:US20180156426A1
公开(公告)日:2018-06-07
申请号:US15724896
申请日:2017-10-04
发明人: Yongli Feng , Yong fen Chen , Brian Morgan Spahnie , Yan Ni
CPC分类号: F21V19/005 , F21K9/90 , F21S4/28 , F21V23/002 , F21Y2105/10 , F21Y2115/10 , H01L33/486 , H05K3/0058 , H05K3/305 , H05K2201/09036 , H05K2201/10106 , Y02P70/613
摘要: An LED module having improved bonding features is described. In some embodiments, an LED module includes at least one LED light source, at least one wire, and a housing that has a rear wall having a surface. A flow channel is cut into at least one portion of the surface of the rear wall, which provides additional surface area when glue is applied to affix the housing of the LED module to a substrate.
-
公开(公告)号:US20180153039A1
公开(公告)日:2018-05-31
申请号:US15715551
申请日:2017-09-26
发明人: Kyung-hwa LIM , Sangan KWON , Kyunho KIM , Yong-jin SHIN , Shimho YI , Heebum PARK
CPC分类号: H05K1/142 , G09G3/2092 , G09G3/3225 , G09G3/3648 , G09G2310/08 , G09G2380/02 , H05K1/028 , H05K1/111 , H05K1/147 , H05K1/18 , H05K3/363 , H05K2201/055 , H05K2201/058 , H05K2201/09027 , H05K2201/09036 , H05K2201/10128
摘要: A display device includes a display panel, a first circuit board, a control unit disposed on the first circuit board, a second circuit board, and a coupling film which electrically couples the control unit and the second circuit board to each other. The coupling film includes a first coupling part including a first region attached to the first circuit board, and a second region overlapping the display panel when viewed in a thickness direction of the display panel, a second coupling part including a third region attached to the second circuit board, and a fourth region overlapping the display panel when viewed in the thickness direction of the display panel, and a third coupling part coupled to each of the second region and the fourth region to electrically couple the first coupling part and the second coupling part to each other.
-
公开(公告)号:US20180138646A1
公开(公告)日:2018-05-17
申请号:US15800161
申请日:2017-11-01
发明人: Yi-Fang CHUANG , Nai-Chien CHANG
CPC分类号: H01R24/60 , H01R12/52 , H01R13/6594 , H01R13/665 , H01R24/64 , H01R2107/00 , H05K1/117 , H05K1/141 , H05K3/368 , H05K2201/042 , H05K2201/09036 , H05K2201/10189 , H05K2201/10303
摘要: A USB connecting apparatus includes a board member, a plurality of first conductive connection portions, a metal housing and an assembly structure. The board member is a printed circuit board complying with the USB-Type C specification and includes a main body portion and a tongue portion. The tongue portion includes two surfaces facing toward each other. Each first conductive connection portion is electrically disposed on at least one surface of the tongue portion in order to form a tongue plate. The metal housing is arranged on the board member and surrounds the tongue plate correspondingly. The assembly structure is arranged on the plate member and/or the metal housing. The plate member and the metal housing are positioned relative to each other via the assembly structure. Accordingly, the USB connecting apparatus can be used on an existing electronic product circuit board and can be directly used as USB Type-C.
-
公开(公告)号:US09974201B1
公开(公告)日:2018-05-15
申请号:US15337841
申请日:2016-10-28
CPC分类号: H05K5/0247 , H01B17/265 , H01G4/35 , H02M1/44 , H05K1/0243 , H05K1/0296 , H05K1/162 , H05K1/167 , H05K7/1402 , H05K7/1427 , H05K9/0018 , H05K2201/09036 , H05K2201/0999
摘要: A feedthrough includes a flange comprising an inner cylindrical surface and a planar mounting surface. The inner cylindrical surface defines a cylindrical passage within the flange. The feedthrough further includes a printed circuit board (“PCB”) mounted on the planar mounting surface of the flange, and an electrically conductive element that extends through the cylindrical passage of the flange.
-
公开(公告)号:US20180102329A1
公开(公告)日:2018-04-12
申请号:US15831554
申请日:2017-12-05
发明人: James A. BUSBY , Silvio DRAGONE , Michael A. GAYNES , Kenneth P. RODBELL , William SANTIAGO-FERNANDEZ
CPC分类号: H01L23/576 , G06F21/87 , H01L21/4803 , H01L23/053 , H01L23/08 , H01L23/573 , H01L24/32 , H01L24/83 , H01L2224/32225 , H01L2224/8385 , H01L2924/0665 , H01L2924/1434 , H01L2924/15192 , H01L2924/16251 , H01L2924/16588 , H05K1/0275 , H05K1/0284 , H05K1/0306 , H05K1/181 , H05K3/303 , H05K3/46 , H05K2201/09036 , H05K2201/0999 , H05K2201/10159 , H05K2201/10371
摘要: Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).
-
公开(公告)号:US20180070435A1
公开(公告)日:2018-03-08
申请号:US15806456
申请日:2017-11-08
发明人: Hirofumi SHINAGAWA , Shigeru TAGO
CPC分类号: H05K1/025 , H05K1/0216 , H05K1/0219 , H05K1/0225 , H05K1/024 , H05K1/028 , H05K1/0298 , H05K1/0313 , H05K1/0393 , H05K1/115 , H05K3/4632 , H05K3/4635 , H05K3/4685 , H05K2201/0129 , H05K2201/0141 , H05K2201/09036 , H05K2203/063
摘要: A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates.
-
10.
公开(公告)号:US20180065202A1
公开(公告)日:2018-03-08
申请号:US15259921
申请日:2016-09-08
申请人: Raytheon Company
发明人: Matthew H. Summers , Jeremy C. Danforth , David G. Garrett , Dmitry V. Knyazev , Stephen M. Baggs , Gaines S. Gibson
CPC分类号: B23K1/0016 , B23K35/0244 , B23K2101/36 , B33Y10/00 , B33Y80/00 , F42B10/661 , H01R4/02 , H01R4/027 , H01R12/51 , H01R12/57 , H01R13/6658 , H01R43/02 , H05K1/0272 , H05K3/3494 , H05K2201/09036 , H05K2203/081
摘要: A method of making an electrical connection includes soldering using channels in a receptacle to direct hot air (or another hot gas) to effect soldering where the electrical connection is to be made. The connection may be made between device electrical contacts of an electrical device, and other contacts, such as receptacle contacts of the receptacle. The connection may be a blind connection, one in which the connected ends of the contacts are hidden or unable to be directly physically accessed, when the connection is made. The electrical connection may be made between device contacts of an electrical device that is inserted into the receptacle, and receptacle electrical contacts that are part of the receptacle. The channels for directing the hot gas to where the soldering occurs may be parts of the receptacle, for example being produced during additive manufacture of the receptacle.
-
-
-
-
-
-
-
-
-