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    Multi-Band Low Noise Amplifier, Phased Array, and Electronic Device
    2.
    发明申请
    Multi-Band Low Noise Amplifier, Phased Array, and Electronic Device 有权

    公开(公告)号：US20240396504A1

    公开(公告)日：2024-11-28

    申请号：US18321090

    申请日：2023-05-22

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Keji Cui ,  Di Li ,  Yongchang Yu

    IPC: H03F1/26 ,  H01Q1/24 ,  H01Q5/335 ,  H03F1/56 ,  H03F3/24

    Abstract: This application provides a multi-band low noise amplifier, including: an input end, a first input matching network, a second input matching network, a first amplifier, and a second amplifier. The input end is coupled to an antenna and is configured to receive an inter-band carrier aggregation signal, where the inter-band carrier aggregation signal includes a first carrier signal located in a first band and a second carrier signal located in a second band, and the first band is different from and does not overlap the second band. The first input matching network is coupled between the input end and the first amplifier and is configured to perform impedance matching for the first carrier signal. The second input matching network is coupled between the input end and the second amplifier and is configured to perform impedance matching for the second carrier signal.

    Phased Array and Electronic Device
    3.
    发明公开
    Phased Array and Electronic Device 审中-公开

    公开(公告)号：US20230344125A1

    公开(公告)日：2023-10-26

    申请号：US18345373

    申请日：2023-06-30

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Keji Cui ,  Di Li ,  Peng Gao ,  Yongchang Yu

    IPC: H01Q3/36 ,  H03K5/00 ,  H04B7/06

    CPC classification number: H01Q3/36 ,  H03K5/00006 ,  H04B7/0617 ,  H03K2005/00286

    Abstract: A phased array includes a local oscillator signal adjustment path, a first adder, a first power divider, and a plurality of radio-frequency signal transmit channels. An output end of the local oscillator signal adjustment path is coupled to a first input end of the first adder, and is configured to input a first signal to the first adder. A second input end of the first adder is coupled to a transmit path, and is configured to receive a second signal, and the first adder superimposes the first signal on the second signal to generate a to-be-transmitted signal. An input end of the first power divider is coupled to an output end of the first adder, an output end of the first power divider is coupled to input ends of the plurality of radio-frequency signal transmit channels.

    Multi-Band Radio Frequency Front-End Device, Multi-Band Receiver, and Multi-Band Transmitter
    5.
    发明申请
    Multi-Band Radio Frequency Front-End Device, Multi-Band Receiver, and Multi-Band Transmitter 有权

    公开(公告)号：US20210328606A1

    公开(公告)日：2021-10-21

    申请号：US17360247

    申请日：2021-06-28

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Keji Cui ,  Di Li ,  Lei Lu

    IPC: H04B1/04 ,  H04B1/00

    Abstract: A multi-band radio frequency front-end device, a multi-band receiver, and a multi-band transmitter, the multi-band radio frequency front-end device including a first radio frequency front-end circuit, where the first radio frequency front-end circuit works on a first band, a second radio frequency front-end circuit, where the second radio frequency front-end circuit works on a second band, a first input/output matching network, and a second input/output matching network, where routing of the first input/output matching network and routing of the second input/output matching network on a layout are annular and nested.

    Transceiver Apparatus, Wireless Communication Apparatus, and Chipset
    7.
    发明申请
    Transceiver Apparatus, Wireless Communication Apparatus, and Chipset 有权

    公开(公告)号：US20220416835A1

    公开(公告)日：2022-12-29

    申请号：US17929613

    申请日：2022-09-02

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Di Li ,  Keji Cui ,  Kefeng Han ,  Lei Lu

    IPC: H04B1/48

    Abstract: A transceiver includes a package substrate and a die, and a transceiver switch is disposed in the transceiver. The transceiver switch includes an antenna feedpoint, a transmit feedpoint and a receive feedpoint that are coupled to the antenna feedpoint, and a first metal connection line disposed on the package substrate, and the antenna feedpoint and the receive feedpoint are disposed at two ends of the first metal connection line. The transceiver switch further includes a first switch, a transmit pad, and a receive pad that are disposed on the die, a first terminal of the first switch is coupled to the receive pad, a second terminal of the first switch is coupled to a ground terminal of the die, the receive pad is coupled to the receive feedpoint, and the transmit pad is coupled to the transmit feedpoint.

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