Radio-Frequency Chip
    3.
    发明申请

    公开(公告)号:US20230090113A1

    公开(公告)日:2023-03-23

    申请号:US18070096

    申请日:2022-11-28

    Abstract: A radio-frequency chip is provided, and relates to the field of chip technologies, to reduce a component loss caused by redundant components in the radio-frequency chip. The radio-frequency chip includes a phased array, the phased array includes a plurality of branches, and each of the plurality of branches includes a transmitting path, a receiving path, a common path, and a phase shifter. The phase shifter includes a first phase shift unit, a second phase shift unit, and a third phase shift unit. The first phase shift unit is located on the transmitting path, the second phase shift unit is located on the receiving path, and the third phase shift unit is located on the common path.

    Amplifier, amplification circuit and phase shifter

    公开(公告)号:US11533031B2

    公开(公告)日:2022-12-20

    申请号:US17037224

    申请日:2020-09-29

    Abstract: Amplifiers, amplification circuits, and phase shifters, for example, for flexibly adjusting an output phase to thereby meet a requirement of a constant phase on a link in a communications field, are provided. In one aspect, an amplifier includes first, second, and third MOS transistors. The first MOS transistor includes a gate separately coupled to a signal input end and a bias voltage input end, a source coupled to a power supply, and a drain separately coupled to sources of the second and third MOS transistors. A drain of the third MOS transistor is coupled to a ground, and a drain of the second MOS transistor is coupled to a signal output end. The bias voltage input end is configured to receive a bias voltage to adjust a phase difference between an input signal at the signal input end and an output signal at the signal output end.

    Radio-frequency chip
    5.
    发明授权

    公开(公告)号:US12301265B2

    公开(公告)日:2025-05-13

    申请号:US18070096

    申请日:2022-11-28

    Abstract: A radio-frequency chip is provided, and relates to the field of chip technologies, to reduce a component loss caused by redundant components in the radio-frequency chip. The radio-frequency chip includes a phased array, the phased array includes a plurality of branches, and each of the plurality of branches includes a transmitting path, a receiving path, a common path, and a phase shifter. The phase shifter includes a first phase shift unit, a second phase shift unit, and a third phase shift unit. The first phase shift unit is located on the transmitting path, the second phase shift unit is located on the receiving path, and the third phase shift unit is located on the common path.

    Transceiver Apparatus, Wireless Communication Apparatus, and Chipset

    公开(公告)号:US20220416835A1

    公开(公告)日:2022-12-29

    申请号:US17929613

    申请日:2022-09-02

    Abstract: A transceiver includes a package substrate and a die, and a transceiver switch is disposed in the transceiver. The transceiver switch includes an antenna feedpoint, a transmit feedpoint and a receive feedpoint that are coupled to the antenna feedpoint, and a first metal connection line disposed on the package substrate, and the antenna feedpoint and the receive feedpoint are disposed at two ends of the first metal connection line. The transceiver switch further includes a first switch, a transmit pad, and a receive pad that are disposed on the die, a first terminal of the first switch is coupled to the receive pad, a second terminal of the first switch is coupled to a ground terminal of the die, the receive pad is coupled to the receive feedpoint, and the transmit pad is coupled to the transmit feedpoint.

    Multi-Band Low Noise Amplifier, Phased Array, and Electronic Device

    公开(公告)号:US20240396504A1

    公开(公告)日:2024-11-28

    申请号:US18321090

    申请日:2023-05-22

    Abstract: This application provides a multi-band low noise amplifier, including: an input end, a first input matching network, a second input matching network, a first amplifier, and a second amplifier. The input end is coupled to an antenna and is configured to receive an inter-band carrier aggregation signal, where the inter-band carrier aggregation signal includes a first carrier signal located in a first band and a second carrier signal located in a second band, and the first band is different from and does not overlap the second band. The first input matching network is coupled between the input end and the first amplifier and is configured to perform impedance matching for the first carrier signal. The second input matching network is coupled between the input end and the second amplifier and is configured to perform impedance matching for the second carrier signal.

    Phased Array and Electronic Device
    9.
    发明公开

    公开(公告)号:US20230344125A1

    公开(公告)日:2023-10-26

    申请号:US18345373

    申请日:2023-06-30

    CPC classification number: H01Q3/36 H03K5/00006 H04B7/0617 H03K2005/00286

    Abstract: A phased array includes a local oscillator signal adjustment path, a first adder, a first power divider, and a plurality of radio-frequency signal transmit channels. An output end of the local oscillator signal adjustment path is coupled to a first input end of the first adder, and is configured to input a first signal to the first adder. A second input end of the first adder is coupled to a transmit path, and is configured to receive a second signal, and the first adder superimposes the first signal on the second signal to generate a to-be-transmitted signal. An input end of the first power divider is coupled to an output end of the first adder, an output end of the first power divider is coupled to input ends of the plurality of radio-frequency signal transmit channels.

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