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1.
公开(公告)号:US12113559B2
公开(公告)日:2024-10-08
申请号:US18315896
申请日:2023-05-11
Applicant: Huawei Technologies Co., Ltd.
CPC classification number: H04B1/0458 , H04B1/0057 , H04B2001/0416 , H04B2001/307
Abstract: A multi-band radio frequency front-end device, a multi-band receiver, and a multi-band transmitter, the multi-band radio frequency front-end device including a first radio frequency front-end circuit, where the first radio frequency front-end circuit works on a first band, a second radio frequency front-end circuit, where the second radio frequency front-end circuit works on a second band, a first input/output matching network, and a second input/output matching network, where routing of the first input/output matching network and routing of the second input/output matching network on a layout are annular and nested.
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2.
公开(公告)号:US20230283307A1
公开(公告)日:2023-09-07
申请号:US18315896
申请日:2023-05-11
Applicant: Huawei Technologies Co., Ltd.
CPC classification number: H04B1/0458 , H04B1/0057 , H04B2001/0416 , H04B2001/307
Abstract: A multi-band radio frequency front-end device, a multi-band receiver, and a multi-band transmitter, the multi-band radio frequency front-end device including a first radio frequency front-end circuit, where the first radio frequency front-end circuit works on a first band, a second radio frequency front-end circuit, where the second radio frequency front-end circuit works on a second band, a first input/output matching network, and a second input/output matching network, where routing of the first input/output matching network and routing of the second input/output matching network on a layout are annular and nested.
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公开(公告)号:US20230090113A1
公开(公告)日:2023-03-23
申请号:US18070096
申请日:2022-11-28
Applicant: Huawei Technologies Co., Ltd.
Inventor: Yong Huang , Keji Cui , Lei Lu
Abstract: A radio-frequency chip is provided, and relates to the field of chip technologies, to reduce a component loss caused by redundant components in the radio-frequency chip. The radio-frequency chip includes a phased array, the phased array includes a plurality of branches, and each of the plurality of branches includes a transmitting path, a receiving path, a common path, and a phase shifter. The phase shifter includes a first phase shift unit, a second phase shift unit, and a third phase shift unit. The first phase shift unit is located on the transmitting path, the second phase shift unit is located on the receiving path, and the third phase shift unit is located on the common path.
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公开(公告)号:US11533031B2
公开(公告)日:2022-12-20
申请号:US17037224
申请日:2020-09-29
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Keji Cui , Yongli Wang , Lei Lu
Abstract: Amplifiers, amplification circuits, and phase shifters, for example, for flexibly adjusting an output phase to thereby meet a requirement of a constant phase on a link in a communications field, are provided. In one aspect, an amplifier includes first, second, and third MOS transistors. The first MOS transistor includes a gate separately coupled to a signal input end and a bias voltage input end, a source coupled to a power supply, and a drain separately coupled to sources of the second and third MOS transistors. A drain of the third MOS transistor is coupled to a ground, and a drain of the second MOS transistor is coupled to a signal output end. The bias voltage input end is configured to receive a bias voltage to adjust a phase difference between an input signal at the signal input end and an output signal at the signal output end.
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公开(公告)号:US12301265B2
公开(公告)日:2025-05-13
申请号:US18070096
申请日:2022-11-28
Applicant: Huawei Technologies Co., Ltd.
Inventor: Yong Huang , Keji Cui , Lei Lu
Abstract: A radio-frequency chip is provided, and relates to the field of chip technologies, to reduce a component loss caused by redundant components in the radio-frequency chip. The radio-frequency chip includes a phased array, the phased array includes a plurality of branches, and each of the plurality of branches includes a transmitting path, a receiving path, a common path, and a phase shifter. The phase shifter includes a first phase shift unit, a second phase shift unit, and a third phase shift unit. The first phase shift unit is located on the transmitting path, the second phase shift unit is located on the receiving path, and the third phase shift unit is located on the common path.
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公开(公告)号:US12119797B2
公开(公告)日:2024-10-15
申请号:US17490900
申请日:2021-09-30
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Keji Cui , Yongli Wang , Lei Lu
CPC classification number: H03G1/0088 , H03F1/223 , H03F3/45188 , H03G1/0029 , H03F2200/294 , H03F2200/318
Abstract: This application provides example variable gain amplifiers and example phased array transceivers. One example variable gain amplifier includes an amplification circuit, configured to amplify an input signal; a control circuit, configured to control a gain of the amplification circuit by adjusting an output current of the amplification circuit; an inductive load, where the inductive load is coupled to a signal output end of the amplification circuit; and an inductive adjustment circuit, where the inductive adjustment circuit and the inductive load are inductively coupled, and where the inductive adjustment circuit is adjustable.
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公开(公告)号:US20220416835A1
公开(公告)日:2022-12-29
申请号:US17929613
申请日:2022-09-02
Applicant: Huawei Technologies Co., Ltd.
Inventor: Di Li , Keji Cui , Kefeng Han , Lei Lu
IPC: H04B1/48
Abstract: A transceiver includes a package substrate and a die, and a transceiver switch is disposed in the transceiver. The transceiver switch includes an antenna feedpoint, a transmit feedpoint and a receive feedpoint that are coupled to the antenna feedpoint, and a first metal connection line disposed on the package substrate, and the antenna feedpoint and the receive feedpoint are disposed at two ends of the first metal connection line. The transceiver switch further includes a first switch, a transmit pad, and a receive pad that are disposed on the die, a first terminal of the first switch is coupled to the receive pad, a second terminal of the first switch is coupled to a ground terminal of the die, the receive pad is coupled to the receive feedpoint, and the transmit pad is coupled to the transmit feedpoint.
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公开(公告)号:US20240396504A1
公开(公告)日:2024-11-28
申请号:US18321090
申请日:2023-05-22
Applicant: Huawei Technologies Co., Ltd.
Inventor: Keji Cui , Di Li , Yongchang Yu
Abstract: This application provides a multi-band low noise amplifier, including: an input end, a first input matching network, a second input matching network, a first amplifier, and a second amplifier. The input end is coupled to an antenna and is configured to receive an inter-band carrier aggregation signal, where the inter-band carrier aggregation signal includes a first carrier signal located in a first band and a second carrier signal located in a second band, and the first band is different from and does not overlap the second band. The first input matching network is coupled between the input end and the first amplifier and is configured to perform impedance matching for the first carrier signal. The second input matching network is coupled between the input end and the second amplifier and is configured to perform impedance matching for the second carrier signal.
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公开(公告)号:US20230344125A1
公开(公告)日:2023-10-26
申请号:US18345373
申请日:2023-06-30
Applicant: Huawei Technologies Co., Ltd.
Inventor: Keji Cui , Di Li , Peng Gao , Yongchang Yu
CPC classification number: H01Q3/36 , H03K5/00006 , H04B7/0617 , H03K2005/00286
Abstract: A phased array includes a local oscillator signal adjustment path, a first adder, a first power divider, and a plurality of radio-frequency signal transmit channels. An output end of the local oscillator signal adjustment path is coupled to a first input end of the first adder, and is configured to input a first signal to the first adder. A second input end of the first adder is coupled to a transmit path, and is configured to receive a second signal, and the first adder superimposes the first signal on the second signal to generate a to-be-transmitted signal. An input end of the first power divider is coupled to an output end of the first adder, an output end of the first power divider is coupled to input ends of the plurality of radio-frequency signal transmit channels.
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10.
公开(公告)号:US11683054B2
公开(公告)日:2023-06-20
申请号:US17360247
申请日:2021-06-28
Applicant: Huawei Technologies Co., Ltd.
CPC classification number: H04B1/0458 , H04B1/0057 , H04B2001/0416 , H04B2001/307
Abstract: A multi-band radio frequency front-end device, a multi-band receiver, and a multi-band transmitter, the multi-band radio frequency front-end device including a first radio frequency front-end circuit, where the first radio frequency front-end circuit works on a first band, a second radio frequency front-end circuit, where the second radio frequency front-end circuit works on a second band, a first input/output matching network, and a second input/output matching network, where routing of the first input/output matching network and routing of the second input/output matching network on a layout are annular and nested.
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