公开(公告)号：US20240015933A1

公开(公告)日：2024-01-11

申请号：US18472606

申请日：2023-09-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaodong Li ,  Huabin Rong ,  Dongming Lu

IPC: H05K7/20

CPC classification number: H05K7/2039

Abstract: This application provides a heat dissipation apparatus for an optical module, and a communication device, and relates to the field of communication device technologies, to improve heat dissipation of an optical module. The heat dissipation apparatus for an optical module provided in this application includes a heat dissipation substrate, including a plurality of first heat dissipation parts, a plurality of adapter parts, and a second heat dissipation part. The plurality of first heat dissipation parts are in a one-to-one correspondence with the plurality of adapter parts. Each adapter part is configured to connect the first heat dissipation part corresponding thereto and the second heat dissipation part, and the plurality of first heat dissipation parts, the plurality of adapter parts, and the second heat dissipation part are integrally formed.