公开(公告)号：US20240015933A1

公开(公告)日：2024-01-11

申请号：US18472606

申请日：2023-09-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaodong Li ,  Huabin Rong ,  Dongming Lu

IPC: H05K7/20

CPC classification number: H05K7/2039

Abstract: This application provides a heat dissipation apparatus for an optical module, and a communication device, and relates to the field of communication device technologies, to improve heat dissipation of an optical module. The heat dissipation apparatus for an optical module provided in this application includes a heat dissipation substrate, including a plurality of first heat dissipation parts, a plurality of adapter parts, and a second heat dissipation part. The plurality of first heat dissipation parts are in a one-to-one correspondence with the plurality of adapter parts. Each adapter part is configured to connect the first heat dissipation part corresponding thereto and the second heat dissipation part, and the plurality of first heat dissipation parts, the plurality of adapter parts, and the second heat dissipation part are integrally formed.

公开(公告)号：US11269386B2

公开(公告)日：2022-03-08

申请号：US16986380

申请日：2020-08-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hao Sun ,  Lv Chen ,  Dongming Lu

IPC: G06F1/18 ,  G06F1/20 ,  H05K7/20

Abstract: A chassis of a server comprises a backplane. The backplane is disposed in the chassis of the server, and the backplane includes a first sub-board, a second sub-board, and at least one air baffle. The first sub-board is isolated from the second sub-board. Each air baffle forms an included angle with the first sub-board and forms an included angle with the second sub-board. Space enclosed by the first sub-board, the second sub-board, and a side wall, an upper wall, and a lower wall of the chassis is divided into a first air cavity and at least one second air cavity by using the at least one air baffle. The first air cavity is used for at least one first module to dissipate heat, and the second air cavity is used for at least one second module to dissipate heat.