公开(公告)号：US20230246332A1

公开(公告)日：2023-08-03

申请号：US18299384

申请日：2023-04-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Tao PU ,  Lihong JIANG ,  Lan YOU ,  Dingjiu DAOJIAN ,  Huafeng ZHANG ,  Jianping LI

IPC: H01Q5/28 ,  H01Q1/24 ,  G01S7/282

CPC classification number: H01Q5/28 ,  H01Q1/241 ,  G01S7/282

Abstract: This application provides a communication apparatus. The communication apparatus includes at least one transmit antenna unit, at least one receive antenna unit, and a signal processing unit. The signal processing unit is configured to: control the at least one transmit antenna unit and the at least one receive antenna unit to communicate with at least one first terminal on a first frequency band; control at least one target transmit antenna unit to send a radar signal on a second frequency band; and control at least one target receive antenna unit to receive a first echo signal on the second frequency band. The at least one transmit antenna unit includes the at least one target transmit antenna unit. The at least one receive antenna unit includes the at least one target receive antenna unit. The first frequency band and the second frequency band do not overlap.

公开(公告)号：US20200350274A1

公开(公告)日：2020-11-05

申请号：US16931819

申请日：2020-07-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiajie TANG ,  Guanhong YE ,  Laicun LIN ,  Guowen LIU ,  Shuai ZHENG ,  Huafeng ZHANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.