公开(公告)号：US20230018137A1

公开(公告)日：2023-01-19

申请号：US17954203

申请日：2022-09-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhi YUAN ,  Jian SHI ,  Hanru YU ,  Linfang JIN

IPC: G06F1/16 ,  G06F1/20

Abstract: Example mobile terminals are disclosed. One example terminal includes a rotating member, a flexible screen, a bending support part, and a temperature equalization plate. The flexible screen includes two unfolded regions and a bent region that is disposed opposite to the rotating member. The bending support part is located between the flexible screen and the rotating member. The temperature equalization plate is configured to balance temperatures in the two unfolded regions and includes two temperature equalization parts opposite to the two unfolded regions in a one-to-one correspondence and a flexible connection part that connects the two temperature equalization parts. The flexible connection part is located on a side of the bending support part and away from the flexible screen.

公开(公告)号：US20220256740A1

公开(公告)日：2022-08-11

申请号：US17732684

申请日：2022-04-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yongfu SUN ,  Jian SHI ,  Zhi YUAN ,  Linfang JIN ,  Jie YANG

IPC: H05K7/20

Abstract: This application relates to a temperature equalization component and an electronic device. The temperature equalization component may include a housing and a capillary structure. The housing may include a cavity, and the capillary structure is located in the cavity and is disposed on a side that is of the housing and that faces a heating element. The housing is provided with a first protrusion part and/or a first depression part, and the temperature equalization component is in direct contact with the heating element by using the first protrusion part and/or the first depression part, thereby improving heat transfer efficiency, reducing a probability that heat accumulates around the heating element, and improving a heat dissipation effect of the temperature equalization component.

公开(公告)号：US20220357636A1

公开(公告)日：2022-11-10

申请号：US17871533

申请日：2022-07-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Sen WANG ,  Jian SHI ,  Zhi YUAN ,  Weidong TANG ,  Along ZHOU ,  Chenhan LIU

IPC: G03B17/55 ,  G03B30/00 ,  H04N5/225

Abstract: A camera assembly is provided. The camera assembly includes an auxiliary mount, a rotatable camera module and a flexible heat conducting assembly, the rotatable camera module includes a rotatable mount and a camera function group disposed on the rotatable mount, the rotatable mount is rotatably connected to the auxiliary mount, the flexible heat conducting assembly is fixedly connected to one end of the camera function group, and the flexible heat conducting assembly is further configured to be connected to a non-rotatable camera module component, so that heat generated by the camera function group is transferred to the non-rotatable camera module component. A flexible heat conducting assembly performs a cross-region transfer of heat generated by the rotatable camera module, to help reduce an ambient temperature of the rotatable camera module, so as to improve photography quality of the camera module, and prolong a photography time period of the rotatable camera module.

公开(公告)号：US20130213602A1

公开(公告)日：2013-08-22

申请号：US13729142

申请日：2012-12-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jian SHI ,  Lei Li

IPC: F28F99/00

CPC classification number: F28F99/00 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2021/0029 ,  F28F1/24 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a cooling system for cooling a heat generating unit comprising an exchangeable heat sink unit being arranged removably connected to the heat generating unit in an assembled state of the cooling system, wherein further comprises a heat dissipation structure and a heat output connector arranged in the heat generating unit, where the heat dissipation structure is arranged to dissipate heat from at least one heat generating componentin the heat generating unit to the heat output connector, where further the exchangeable heat sink unit comprises a heat sink and a heat sink heat dissipation structure and a heat input connector, where the heat input connector is arranged to connect to said heat output connector to dissipate heat from said heat output connector via the heat sink heat dissipation structure to the heat sink. The invention also relates to a method for cooling a heat generating unit.

Abstract translation: 本发明涉及一种用于冷却发热单元的冷却系统，该冷却系统包括一个可更换的散热单元，该热交换器单元在冷却系统的组装状态下可移除地连接到该发热单元，其中还包括散热结构和一个热输出连接器， 在发热单元中，散热结构布置成将热量从发热单元中的至少一个发热部件散热到热输出连接器，此外，可更换散热器单元包括散热器和散热器散热 结构和热输入连接器，其中热输入连接器被布置成连接到所述热输出连接器，以将来自所述热输出连接器的热量经由散热器散热结构散发到散热器。 本发明还涉及一种用于冷却发热单元的方法。

公开(公告)号：US20230022994A1

公开(公告)日：2023-01-26

申请号：US17951274

申请日：2022-09-23

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yongfu SUN ,  Jie YANG ,  Jian SHI

IPC: G06F1/20 ,  H05K7/20 ,  H01Q1/02

Abstract: A mobile terminal includes middle frame assembly that is configured to bear an electronic component in the mobile terminal. The electronic component includes a heat source, and the middle frame assembly includes a middle frame, one or more heat pipes, and a first vapor chamber. The middle frame includes a heat dissipation region corresponding to the heat source. The first vapor chamber is accommodated in the heat dissipation region. The heat pipes are connected to the first vapor chamber, and are configured to dissipate heat from the first vapor chamber. This structure of the mobile terminal and the middle frame assembly of the mobile terminal improves heat dissipation performance of the mobile terminal.

公开(公告)号：US20130213605A1

公开(公告)日：2013-08-22

申请号：US13731457

申请日：2012-12-31

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jian SHI ,  Bjorn Gudmundsson ,  Wangjun Wu

IPC: F28F9/00

CPC classification number: F28F9/00 ,  H01L23/473 ,  H01L2924/0002 ,  H04B1/036 ,  H05K7/20218 ,  H05K7/20254 ,  H01L2924/00

Abstract: The invention relates to a liquid cooling system comprising a cooling unit and a liquid loop in which the liquid is arranged to be conveyed from a supply outlet of the cooling unit to a radio unit where the liquid is arranged to cool the radio unit before being conveyed back in the liquid loop to a return inlet of the cooling unit, the cooling unit being arranged located at a distance from the radio unit, wherein the cooling unit is an expandable cooling unit comprising a secondary outlet and a secondary inlet where, when an additional cooling unit of the liquid cooling system is connected with an inlet to said secondary outlet and with an outlet to said secondary inlet, the liquid is arranged to be fed from the cooling unit through the secondary outlet to the additional cooling unit arranged to also cool the liquid.

Abstract translation: 本发明涉及一种液体冷却系统，其包括冷却单元和液体回路，其中液体被布置成从冷却单元的供应出口传送到无线电单元，其中液体被布置成在被传送之前冷却无线电单元 将液体回路返回到冷却单元的返回入口，冷却单元布置成距离无线电单元一定距离，其中冷却单元是包括次级出口和次级入口的可扩展冷却单元，其中当附加 液体冷却系统的冷却单元与所述次级出口的入口连接，并且与出口连接到所述次级入口，液体被布置成从冷却单元通过次级出口供给到另外的冷却单元， 液体。