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公开(公告)号:US20200218102A1
公开(公告)日:2020-07-09
申请号:US16637908
申请日:2017-08-11
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Shanshan WEI , Jianhui LI , Taixiang LIU
IPC: G02F1/1339 , G02F1/13357 , G02F1/1335
Abstract: A display panel includes: an array substrate and a color film substrate that are disposed opposite to each other; liquid crystal molecules located between the array substrate and the color film substrate; and a sealing structure sealing the liquid crystal molecules, where the sealing structure is at least partially located on sides of the array substrate and the color film substrate. The sealing structure sealing the liquid crystal molecules is at least partially disposed on the sides of the array substrate and the color film substrate, to reduce an area of the sealing structure between the array substrate and the color film substrate while ensuring sealability of the sealing structure.
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公开(公告)号:US20230251345A1
公开(公告)日:2023-08-10
申请号:US18191998
申请日:2023-03-29
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Jiajia YOU , Yong CHEN , Jianhui LI , Zengcai SUN , Qi WANG
CPC classification number: G01S5/18 , G06F3/1446
Abstract: A first electronic device determines that a first trigger condition is satisfied, sends a first instruction to enable a first sound wave transmitter to send a first sound wave signal, and sends a second instruction to enable a second sound wave transmitter to send a second sound wave signal. A second electronic device sends a third instruction to enable a first sound wave receiver to receive the first sound wave signal and the second sound wave signal, calculates a first receiving start moment and a second receiving start moment, obtains first location information, determines second location information based on the first receiving start moment, the second receiving start moment, and the first location information, and sends the second location information to the first electronic device. The first electronic device updates third location information by using the second location information.
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公开(公告)号:US20230008676A1
公开(公告)日:2023-01-12
申请号:US17871641
申请日:2022-07-22
Applicant: Huawei Technologies Co., Ltd.
Inventor: Jianhui LI , Zhenguo DU , Hongcheng ZHUANG
Abstract: This application discloses a system information updating method, an apparatus, and a system. The method includes: receiving, by the wake-up radio WUR interface of the user equipment, a wake-up signal sent by a base station, where the wake-up signal is used to wake up a main radio interface of the user equipment and instruct the main radio interface of the user equipment to receive updated system information, the wake-up signal includes system information SI update transmission control information, and the SI update transmission control information includes information required for receiving the updated system information; waking up, by the WUR interface of the user equipment, the main radio interface of the user equipment; and receiving, by the user equipment according to the SI update transmission control information through the woken-up main radio interface, the updated system information sent by the base station.
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公开(公告)号:US20240284763A1
公开(公告)日:2024-08-22
申请号:US18570875
申请日:2022-05-05
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Haohui LONG , Yingbo ZHAO , Xiaolong LI , Limei HUANG , Jianhui LI , Tian XIAO , Jianping FANG , Shi ZHANG
IPC: H10K59/80
CPC classification number: H10K59/873
Abstract: The present disclosure relates to display apparatuses and methods for manufacturing the display apparatuses. One example display apparatus includes an array substrate and a laminated structure. The array substrate includes a substrate and an array layer located on a side of the substrate. The laminated structure is located on a side that is of the array layer and that is opposite to the substrate, and includes a first film layer and a second film layer. The first film layer is located on a side that is of the second film layer and that is opposite to the substrate, and is formed by a high modulus material. An elastic modulus of the high modulus material is E1, and 50 Mpa≤E1≤5 Gpa. The second film layer is formed by a modified energy absorption impact resistance material has viscosity and shear thickening behavior.
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公开(公告)号:US20210400590A1
公开(公告)日:2021-12-23
申请号:US16963465
申请日:2019-01-22
Applicant: Huawei Technologies Co., Ltd.
Inventor: Jianhui LI , Zhenguo DU , Hongcheng ZHUANG
Abstract: A system information updating method, a user equipment and a base station are provided, the method including: receiving, by the wake-up radio (WUR) interface of the user equipment, a wake-up signal sent by the base station, where the wake-up signal is used to wake up a main radio interface of the user equipment and instruct the main radio interface of the user equipment to receive updated system information, the wake-up signal includes system information (SI) update transmission control information, and the SI update transmission control information includes information required for receiving the updated system information; waking up, by the WUR interface of the user equipment, the main radio interface of the user equipment; and receiving, by the user equipment according to the SI update transmission control information through the woken-up main radio interface, the updated system information sent by the base station.
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公开(公告)号:US20250066652A1
公开(公告)日:2025-02-27
申请号:US18722422
申请日:2022-12-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Yingbo ZHAO , Haohui LONG , Jianhui LI , Jianping FANG , Tian XIAO , Jinrong WU , Qi WU , Hui XIONG , Yue HUANG
IPC: C09J185/04 , C09J7/38 , G09F9/30
Abstract: This application provides an adhesive composition. The adhesive composition includes an adhesive matrix and a modified polymer. A main chain of the modified polymer includes a boron-oxygen coordinate bond and/or a bridging boron-oxygen coordinate bond. A terminal group or a side chain of the modified polymer or both include at least one of a hydroxyl group, an acrylate group, and a vinyl group. This application further provides a preparation method of the adhesive composition, an optical adhesive film, a foldable screen using the optical adhesive film, and an electronic device using the optical adhesive film or the foldable screen.
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公开(公告)号:US20240085555A1
公开(公告)日:2024-03-14
申请号:US18262801
申请日:2022-01-11
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Qi WANG , Jianhui LI , Yuxing WANG , Zhenguo DU
IPC: G01S15/10
CPC classification number: G01S15/104
Abstract: Methods, electronic devices, and chip systems relating to interaction between devices are provided. A method includes: a first electronic device sends a first sound wave signal and a second sound wave signal to a second electronic device by using a first speaker and a second speaker. The first electronic device receives relative position information between the second electronic device and the first electronic device sent by the second electronic device. The relative position information is determined by a receiving result of receiving the first sound wave signal and the second sound wave signal by a first microphone of the second electronic device.
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公开(公告)号:US20210043694A1
公开(公告)日:2021-02-11
申请号:US16979601
申请日:2018-03-31
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Shanshan WEI , Yanfeng LIANG , Haohui LONG , Jianhui LI , Lin QU
Abstract: An electronic device and a method for manufacturing the display apparatus. The electronic device includes a display apparatus and a processor, wherein the display apparatus includes an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board. The touch panel is disposed on an upper surface of the AMOLED panel, and the touch panel and the AMOLED panel each has an outgoing line. The outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel. The outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board PCB by using the chip IC.
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