公开(公告)号：US20150136360A1

公开(公告)日：2015-05-21

申请号：US14581573

申请日：2014-12-23

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yan Xu ,  Renzhe Zhao ,  Songlin Li

IPC: F28D9/00

CPC classification number: F28D9/0087 ,  H01L23/373 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal interface pad, includes a substrate and carbon nanowires, where the substrate has a first surface and a second surface opposite to the first surface, the carbon nanowires are disposed on both the first surface and the second surface of the substrate, and the carbon nanowires are arranged in an array. The substrate includes a flexible composite metal film, or a material of the substrate includes at least one of flexible graphite and a solder alloy, and the flexible composite metal film is a flexible metal film with a surface coated with nickel, silver or gold. The thermal interface material has high thermal conductivity, may be attachable and affixed, and is easy for industrial production and use. The embodiments of the present invention further provide a production method of a thermal interface material, which features a large production volume, low costs, and easy control of product quality.

Abstract translation: 热界面衬垫包括衬底和碳纳米线，其中衬底具有第一表面和与第一表面相对的第二表面，碳纳米线设置在衬底的第一表面和第二表面上，并且碳 纳米线排列成阵列。 所述基板包括柔性复合金属膜，或者所述基板的材料包括柔性石墨和焊料合金中的至少一种，并且所述柔性复合金属膜是表面涂覆有镍，银或金的柔性金属膜。 该热界面材料具有高导热性，可附着和固定，易于工业化生产和使用。 本发明的实施例还提供一种热界面材料的制造方法，其具有大的生产量，低成本和易于控制产品质量。

公开(公告)号：US20180014431A1

公开(公告)日：2018-01-11

申请号：US15696496

申请日：2017-09-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yan Xu ,  Renzhe Zhao

IPC: H05K7/20 ,  H01L23/373 ,  H01L23/367

CPC classification number: H05K7/20509 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/3737 ,  H05K7/20

Abstract: A thermal pad and an electronic device comprising the thermal pad includes a first heat conducting layer and a second heat conducting layer. The first heat conducting layer is deformable under compression, and a heat conduction capability of the first heat conducting layer in a thickness direction of the first heat conducting layer is greater than a heat conduction capability of the first heat conducting layer in a plane direction of the first heat conducting layer. The second heat conducting layer is not deformable under compression, and a heat conduction capability of the second heat conducting layer in a plane direction of the second heat conducting layer is greater than or equal to a heat conduction capability of the second heat conducting layer in a thickness direction of the second heat conducting layer.