公开(公告)号：US20150136360A1

公开(公告)日：2015-05-21

申请号：US14581573

申请日：2014-12-23

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yan Xu ,  Renzhe Zhao ,  Songlin Li

IPC: F28D9/00

CPC classification number: F28D9/0087 ,  H01L23/373 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal interface pad, includes a substrate and carbon nanowires, where the substrate has a first surface and a second surface opposite to the first surface, the carbon nanowires are disposed on both the first surface and the second surface of the substrate, and the carbon nanowires are arranged in an array. The substrate includes a flexible composite metal film, or a material of the substrate includes at least one of flexible graphite and a solder alloy, and the flexible composite metal film is a flexible metal film with a surface coated with nickel, silver or gold. The thermal interface material has high thermal conductivity, may be attachable and affixed, and is easy for industrial production and use. The embodiments of the present invention further provide a production method of a thermal interface material, which features a large production volume, low costs, and easy control of product quality.

Abstract translation: 热界面衬垫包括衬底和碳纳米线，其中衬底具有第一表面和与第一表面相对的第二表面，碳纳米线设置在衬底的第一表面和第二表面上，并且碳 纳米线排列成阵列。 所述基板包括柔性复合金属膜，或者所述基板的材料包括柔性石墨和焊料合金中的至少一种，并且所述柔性复合金属膜是表面涂覆有镍，银或金的柔性金属膜。 该热界面材料具有高导热性，可附着和固定，易于工业化生产和使用。 本发明的实施例还提供一种热界面材料的制造方法，其具有大的生产量，低成本和易于控制产品质量。

公开(公告)号：US20140116661A1

公开(公告)日：2014-05-01

申请号：US14145490

申请日：2013-12-31

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yan Xu ,  Yunhua Tu

IPC: F28F3/00 ,  B23P15/26

CPC classification number: F28F3/00 ,  B23P15/26 ,  G06F1/20 ,  H01L23/373 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A thermal pad includes: a thermally conductive sheet-like substrate, where the sheet-like substrate has a compressible porous mesh structure in a thickness direction; and a thermally conductive coating, where the coating is formed of a flexible organic compound, and the organic compound fills inside the sheet-like substrate or is coated on a surface of the sheet-like substrate, or the organic compound both fills inside the sheet-like substrate and is coated on the surface of the sheet-like substrate. In the thermal pad, the method for fabricating a thermal pad, the heat dissipating apparatus, and the electronic device provided in the embodiments of the present application, a thermally conductive flexible organic compound fills inside or is coated on a thermally conductive sheet-like substrate having a compressible porous mesh structure in the thickness direction.

Abstract translation: 散热垫包括：导热片状基板，其中片状基板在厚度方向上具有可压缩多孔网状结构; 和导热涂层，其中涂层由柔性有机化合物形成，并且有机化合物填充在片状基材内部或涂覆在片状基材的表面上，或者有机化合物都填充在片材的内部 并且被涂覆在片状基材的表面上。 在本发明的实施方式中，在散热垫，散热装置以及散热装置以及电子装置的制造方法中，导热性柔性有机化合物填充在导热片状基板 在厚度方向上具有可压缩多孔网状结构。

公开(公告)号：US20140351512A1

公开(公告)日：2014-11-27

申请号：US14454054

申请日：2014-08-07

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yan Xu ,  Yaping Sun ,  Huiqiang Zhou

IPC: G06F3/06

CPC classification number: G06F3/0689 ,  G06F3/0604 ,  G06F3/0607 ,  G06F3/0629 ,  G06F3/0631 ,  G06F3/0632 ,  G06F3/0665

Abstract: Embodiments of the present invention provide a capacity expansion method and device, so as to reduce the time needed by capacity expansion of a hard disk. The method specifically includes: dividing, in a distributed redundant array of independent disks RAID system, each hard disk into virtual hard disks of equal size equally; dividing an original hard disk into X groups equally; selecting m virtual hard disks from each hard disk in sequence to form one original hard disk; selecting m virtual hard disks from each added hard disk and inserting the m virtual hard disks into the virtual hard disk group; moving, in the virtual hard disk group, data in virtual hard disks of the original hard disk to the virtual hard disks of the added hard disk. The present invention is applied to capacity expansion of a hard disk.

Abstract translation: 本发明的实施例提供一种容量扩展方法和装置，以减少硬盘的容量扩展所需的时间。 该方法具体包括：在独立磁盘RAID系统的分布式冗余阵列中，将每个硬盘分成相同大小的虚拟硬盘; 将原始硬盘平均分为X组; 从每个硬盘依次选择m个虚拟硬盘，形成一个原始硬盘; 从每个添加的硬盘中选择m个虚拟硬盘，并将m个虚拟硬盘插入虚拟硬盘组; 在虚拟硬盘组中将原始硬盘的虚拟硬盘中的数据移动到添加的硬盘的虚拟硬盘。 本发明适用于硬盘的容量扩展。

公开(公告)号：US10145029B2

公开(公告)日：2018-12-04

申请号：US14559630

申请日：2014-12-03

Applicant: Huawei Technologies Co., Ltd. ,  Zhejiang University

Inventor： Xiaosong Zhou ,  Yan Xu ,  Chao Gao ,  Zhen Xu

IPC: D01F9/12 ,  D01D5/06 ,  D01F1/09 ,  D01F11/10 ,  C01B32/182 ,  C01B32/194

Abstract: A graphene fiber and a preparation method thereof, where the graphene fiber is a composite fiber of metal nanowire doped graphene fiber, and principal components of the composite fiber are graphene and metal nanowires, a mass ratio of metal nanowires is 0.1%-50%, the graphene is in a form of sheet, and both the metal nanowires and graphene sheets are arranged in parallel along an axial direction of the graphene fiber. The metal nanowire doped graphene fiber is a new type of a high performance multi-functional fiber material, which achieves a significant improvement in electrical conductivity of graphene fibers through doping of metal nanowires and meanwhile demonstrates excellent tensile strength and toughness. The metal nanowire doped graphene fiber has great potential application value in a plurality of fields, for example, it is used as a lightweight flexible wire.

公开(公告)号：US20180014431A1

公开(公告)日：2018-01-11

申请号：US15696496

申请日：2017-09-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yan Xu ,  Renzhe Zhao

IPC: H05K7/20 ,  H01L23/373 ,  H01L23/367

CPC classification number: H05K7/20509 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/3737 ,  H05K7/20

Abstract: A thermal pad and an electronic device comprising the thermal pad includes a first heat conducting layer and a second heat conducting layer. The first heat conducting layer is deformable under compression, and a heat conduction capability of the first heat conducting layer in a thickness direction of the first heat conducting layer is greater than a heat conduction capability of the first heat conducting layer in a plane direction of the first heat conducting layer. The second heat conducting layer is not deformable under compression, and a heat conduction capability of the second heat conducting layer in a plane direction of the second heat conducting layer is greater than or equal to a heat conduction capability of the second heat conducting layer in a thickness direction of the second heat conducting layer.

公开(公告)号：US09354826B2

公开(公告)日：2016-05-31

申请号：US14454054

申请日：2014-08-07

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yan Xu ,  Yaping Sun ,  Huiqiang Zhou

IPC: G06F3/06

CPC classification number: G06F3/0689 ,  G06F3/0604 ,  G06F3/0607 ,  G06F3/0629 ,  G06F3/0631 ,  G06F3/0632 ,  G06F3/0665

Abstract: Embodiments of the present invention provide a capacity expansion method and device, so as to reduce the time needed by capacity expansion of a hard disk. The method specifically includes: dividing, in a distributed redundant array of independent disks RAID system, each hard disk into virtual hard disks of equal size equally; dividing an original hard disk into X groups equally; selecting m virtual hard disks from each hard disk in sequence to form one original hard disk; selecting m virtual hard disks from each added hard disk and inserting the m virtual hard disks into the virtual hard disk group; moving, in the virtual hard disk group, data in virtual hard disks of the original hard disk to the virtual hard disks of the added hard disk. The present invention is applied to capacity expansion of a hard disk.

Abstract translation: 本发明的实施例提供一种容量扩展方法和装置，以减少硬盘的容量扩展所需的时间。 该方法具体包括：在独立磁盘RAID系统的分布式冗余阵列中，将每个硬盘分成相同大小的虚拟硬盘; 将原始硬盘平均分为X组; 从每个硬盘依次选择m个虚拟硬盘，形成一个原始硬盘; 从每个添加的硬盘中选择m个虚拟硬盘，并将m个虚拟硬盘插入虚拟硬盘组; 在虚拟硬盘组中将原始硬盘的虚拟硬盘中的数据移动到添加的硬盘的虚拟硬盘。 本发明适用于硬盘的容量扩展。

公开(公告)号：US10736237B2

公开(公告)日：2020-08-04

申请号：US16175703

申请日：2018-10-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yan Xu ,  Linfang Jin

IPC: F28F7/00 ,  H05K7/20 ,  H01L23/373 ,  B32B9/00 ,  F28F21/02

Abstract: A heat sink, which includes a first surface and a second surface opposite to the first surface, where the second surface includes a plurality of sub-surfaces, and each sub-surface is configured to be in contact with a surface of a heat emitting element; the plurality of sub-surfaces include a first sub-surface, a thickness between the first sub-surface and the first surface is less than a thickness between the first surface and each of the plurality of sub-surfaces except the first sub-surface; and the heat sink includes a plurality of layers of graphene sheets, each layer of graphene sheet includes a plurality of flake graphite particles, and two adjacent flake graphite particles located in a same layer of graphene sheet are covalently bonded.

公开(公告)号：US09389790B2

公开(公告)日：2016-07-12

申请号：US14582509

申请日：2014-12-24

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yan Xu ,  Yaping Sun ,  Huiqiang Zhou

IPC: G06F12/00 ,  G06F3/06 ,  G06F11/10 ,  G06F17/16

CPC classification number: G06F3/0619 ,  G06F3/061 ,  G06F3/064 ,  G06F3/0665 ,  G06F3/0689 ,  G06F11/1076 ,  G06F17/16

Abstract: According to the method for determining a redundant array of independent disks provided in the present invention, for an actual physical disk including n disk groups in which each disk group includes m disks, the n disk groups include m2*(m*n) logical blocks, and a logical block matrix corresponding to m distributed RAIDs can be generated. Therefore, a correspondence between the actual physical disk and the distributed RAIDs can be obtained. In a scenario of data storage or the like, a mapping relationship table of the physical disk and the RAIDs does not need to be stored.

Abstract translation: 根据本发明提供的用于确定独立磁盘的冗余阵列的方法，对于包括n个磁盘组的实际物理磁盘，每个磁盘组包括m个磁盘，n个磁盘组包括m2 *（m * n）个逻辑块 ，并且可以生成与m个分布式RAID相对应的逻辑块矩阵。 因此，可以获得实际物理盘与分布式RAID之间的对应关系。 在数据存储等的情况下，不需要存储物理盘和RAID的映射关系表。