公开(公告)号：US20220141950A1

公开(公告)日：2022-05-05

申请号：US17433213

申请日：2020-02-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Huijuan Wang ,  Jinsen Cai ,  Bin Hu ,  Bo Kong ,  Tian Zhao

IPC: H05K1/02

Abstract: A shielding structure for a system-in-package includes a substrate having stacked first ground planes in the substrate, a second ground plane on a surface of the substrate, and a ground pad arranged along an edge of the substrate disposed on the second ground plane. In addition, ground holes disposed in the substrate electrically couple the adjacent ground planes. The ground holes are arranged in a ring around a board body and spacing between the adjacent ground holes is less than a specified distance in an arrangement that defines a Faraday cage. A device is disposed on the opposing surface of the substrate and a package layer is disposed on the device.

公开(公告)号：US11917750B2

公开(公告)日：2024-02-27

申请号：US17433213

申请日：2020-02-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Huijuan Wang ,  Jinsen Cai ,  Bin Hu ,  Bo Kong ,  Tian Zhao

IPC: H01L23/552 ,  H05K1/02

CPC classification number: H05K1/0224 ,  H01L23/552 ,  H05K2201/0723

Abstract: A shielding structure for a system-in-package includes a substrate having stacked first ground planes in the substrate, a second ground plane on a surface of the substrate, and a ground pad arranged along an edge of the substrate disposed on the second ground plane. In addition, ground holes disposed in the substrate electrically couple the adjacent ground planes. The ground holes are arranged in a ring around a board body and spacing between the adjacent ground holes is less than a specified distance in an arrangement that defines a Faraday cage. A device is disposed on the opposing surface of the substrate and a package layer is disposed on the device.