公开(公告)号：US09893433B2

公开(公告)日：2018-02-13

申请号：US15178646

申请日：2016-06-10

Applicant: Huawei Technologies Co., Ltd.

Inventor： Chang Cao ,  Fabio Morgia ,  Uhland Goebel ,  Guoyu Su

IPC: H01Q13/10 ,  H01Q21/00 ,  H01Q13/18 ,  H01P5/12 ,  H01Q21/06

CPC classification number: H01Q21/0043 ,  H01P5/12 ,  H01Q13/18 ,  H01Q21/0006 ,  H01Q21/005 ,  H01Q21/0093 ,  H01Q21/064

Abstract: The present disclosure provides an array antenna. The array antenna includes a cavity power divider that receives an input signal and performs power division to output a first power-divided signal. The array antenna also includes a final-stage power dividing, coupling, and radiating unit that includes a dielectric substrate and a first and a second metal surface layer. A coupling slot array is formed on the second metal surface layer to receive the first power-divided signal. A radiating slot array corresponding to the coupling slot array is formed on the first metal surface layer; Several plated through-hole units are provided on the dielectric substrate, where the plated through-hole units go through the first and second metal surface layers vertically, and a range corresponding to each plated through-hole unit encloses a coupling slot and a radiating slot corresponding to the coupling slot.

公开(公告)号：US20160301143A1

公开(公告)日：2016-10-13

申请号：US15178646

申请日：2016-06-10

Applicant: Huawei Technologies Co., Ltd.

Inventor： Chang Cao ,  Fabio Morgia ,  Uhland Goebel ,  Guoyu Su

IPC: H01Q21/00

CPC classification number: H01Q21/0043 ,  H01P5/12 ,  H01Q13/18 ,  H01Q21/0006 ,  H01Q21/005 ,  H01Q21/0093 ,  H01Q21/064

Abstract: The present disclosure provides an array antenna. The array antenna includes a cavity power divider that receives an input signal and performs power division to output a first power-divided signal. The array antenna also includes a final-stage power dividing, coupling, and radiating unit that includes a dielectric substrate and a first and a second metal surface layer. A coupling slot array is formed on the second metal surface layer to receive the first power-divided signal. A radiating slot array corresponding to the coupling slot array is formed on the first metal surface layer; Several plated through-hole units are provided on the dielectric substrate, where the plated through-hole units go through the first and second metal surface layers vertically, and a range corresponding to each plated through-hole unit encloses a coupling slot and a radiating slot corresponding to the coupling slot.

Abstract translation: 本公开提供了阵列天线。 阵列天线包括腔功率分配器，其接收输入信号并执行功率分配以输出第一分频信号。 阵列天线还包括最终级功率分配，耦合和辐射单元，其包括电介质基底和第一和第二金属表面层。 耦合槽阵列形成在第二金属表面层上以接收第一分配信号。 在所述第一金属表面层上形成对应于所述耦合槽阵列的辐射槽阵列; 在电介质基板上设置有多个电镀通孔单元，其中电镀通孔单元垂直穿过第一和第二金属表面层，并且与每个电镀通孔单元相对应的范围包围耦合槽和辐射槽 对应于联接槽。