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公开(公告)号：US10074900B2
公开(公告)日：2018-09-11
申请号：US15018747
申请日：2016-02-08
申请人： The Boeing Company
CPC分类号： H01Q3/26 , H01P3/16 , H01Q1/02 , H01Q3/267 , H01Q13/06 , H01Q21/0006 , H01Q21/0025 , H01Q21/0093 , H05K3/30
摘要： Systems and methods according to one or more embodiments are provided for a scalable planar phased array antenna subarray tile assembly. A scalable phased array antenna subarray tile assembly is implemented as a printed wiring board (PWB) with antenna elements coupled to the PWB. In one example, a PWB includes integrated circuit die attached directly to a first surface of the PWB and couple to antenna elements coupled on a second surface of the PWB. First conductive vias extend through a first subset of PWB layers and couple to the integrated circuit die. Second conductive vias, larger than the first, extend through a second subset of PWB layers and couple to the antenna elements. A conductive trace couples the first and second conductive vias on a PWB layer. The second conductive vias are offset from the first to provide a thermal mechanical stress relief to the integrated circuit die.
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公开(公告)号：US09972905B2
公开(公告)日：2018-05-15
申请号：US14617361
申请日：2015-02-09
申请人： HRL LABORATORIES LLC
发明人： James H. Schaffner , Hyok J. Song , Keyvan R. Sayyah , Pamela R. Patterson , Jeong-Sun Moon , Alan E. Reamon , Keerti S. Kona , Joseph S. Colburn
CPC分类号： H01Q3/01 , H01Q1/06 , H01Q3/2676 , H01Q3/46 , H01Q9/0407 , H01Q15/0026 , H01Q19/005 , H01Q21/0093 , H01Q21/065
摘要： A reconfigurable electro-magnetic tile includes a laser layer including a plurality of lasers, and a pixelated surface comprising a plurality of metal patches and a plurality of switches, wherein each respective switch of the plurality of switches is in a gap between a first respective metal patch and a second respective metal patch, wherein each respective switch is optically coupled to at least one respective laser of the plurality of lasers, and wherein each switch of the plurality of switches comprises a phase change material.
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公开(公告)号：US09921313B2
公开(公告)日：2018-03-20
申请号：US14302663
申请日：2014-06-12
CPC分类号： G01S19/02 , G01S1/042 , H01Q3/30 , H01Q21/0093
摘要： An apparatus includes: a Global Positioning System (GPS) phased array comprising a plurality of digital beam forming elements (DBFEs), wherein at least one of the DBFEs includes: an antenna configured to transmit a GPS signal; a radio frequency (RF) electronics section operably connected to the antenna and digital electronics sections; and a digital electronics section operably connected to the RF electronics section. An apparatus includes: a GPS phased array comprising a plurality of DBFEs, wherein at least one of the DBFEs includes: an antenna configured to transmit a GPS signal; an RF electronics section operably connected to the antenna and digital electronics sections; and a digital electronics section operably connected an RF electronic section; a navigation encoder and frequency generator (NEFU) unit operably connected to the GPS phased array; and an atomic frequency standard operably connected to the NEFU unit.
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4.发明申请公开(公告)号：US20170229775A1
公开(公告)日：2017-08-10
申请号：US15018747
申请日：2016-02-08
申请人： The Boeing Company
CPC分类号： H01Q3/26 , H01P3/16 , H01Q1/02 , H01Q3/267 , H01Q21/0006 , H01Q21/0025 , H01Q21/0093 , H05K3/30
摘要： Systems and methods according to one or more embodiments are provided for a scalable planar phased array antenna subarray tile assembly. A scalable phased array antenna subarray tile assembly is implemented as a printed wiring board (PWB) with antenna elements coupled to the PWB. In one example, a PWB includes integrated circuit die attached directly to a first surface of the PWB and couple to antenna elements coupled on a second surface of the PWB. First conductive vias extend through a first subset of PWB layers and couple to the integrated circuit die. Second conductive vias, larger than the first, extend through a second subset of PWB layers and couple to the antenna elements. A conductive trace couples the first and second conductive vias on a PWB layer. The second conductive vias are offset from the first to provide a thermal mechanical stress relief to the integrated circuit die.
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公开(公告)号：US09659904B2
公开(公告)日：2017-05-23
申请号：US14104296
申请日：2013-12-12
申请人： Intel Corporation
CPC分类号： H01Q21/22 , G06K19/077 , H01L24/20 , H01L24/82 , H01L2223/6677 , H01L2224/16227 , H01L2924/15153 , H01L2924/15321 , H01Q21/0025 , H01Q21/0087 , H01Q21/0093 , H01Q21/065 , H01Q23/00
摘要： Embodiments described herein generally relate to phased array antenna systems or packages and techniques of making and using the systems and packages. A phased array antenna package may include a distributed phased array antenna comprising (1) a plurality of antenna sub-arrays, which may each include a plurality of antennas, (2) a plurality of Radio Frequency Dies (RFDs), each of the RFDs located proximate and electrically coupled by a trace of a plurality of traces to a corresponding antenna sub-array of the plurality of antenna sub-arrays, and (3) wherein each trace of the plurality of traces configured to electrically couple an antenna of the plurality of antennas to the RFD located proximate the antenna, wherein each trace of the plurality of traces is configured to transmit millimeter wave (mm-wave) radio signals, and wherein the plurality of traces are each of a substantially uniform length.
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公开(公告)号：US09614277B2
公开(公告)日：2017-04-04
申请号：US14431211
申请日：2013-09-26
申请人： OMNIRADAR BV
IPC分类号： H01Q1/48 , G01S7/03 , H01Q1/22 , H01Q1/38 , H01Q1/42 , H01Q15/08 , H01Q19/06 , H01Q19/10 , H01Q21/00 , H01Q21/06
CPC分类号： H01Q1/48 , G01S7/032 , G01S2007/027 , H01L2224/48227 , H01L2224/97 , H01L2924/181 , H01Q1/2283 , H01Q1/38 , H01Q1/42 , H01Q15/08 , H01Q19/06 , H01Q19/10 , H01Q21/0093 , H01Q21/061 , H01L2924/00012
摘要： A radio frequency module comprises an antenna assembly on a semiconductor integrated circuit that can transmit an electromagnetic signal in a frequency band of interest, or receive an electromagnetic signal in a frequency band of interest, or both. In the radio frequency module, a conductive layer that forms a signal ground plane. At least one semiconductor layer of the semiconductor integrated circuit forms part of this dielectric spacing. The dielectric spacing is arranged so that an electromagnetic signal in the frequency band of interest that traverses through the dielectric spacing from the antenna assembly to the conductive layer that forms the signal ground plane experiences a phase shift comprised in the range between 60 and 120 degrees.
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公开(公告)号：US20160336654A1
公开(公告)日：2016-11-17
申请号：US15112998
申请日：2015-01-21
申请人： DENSO CORPORATION
CPC分类号： H01Q5/55 , H01P3/121 , H01P3/16 , H01P5/087 , H01P5/107 , H01Q1/48 , H01Q9/0407 , H01Q9/045 , H01Q21/0093 , H05K1/0218 , H05K1/0239 , H05K1/115 , H05K2201/09363 , H05K2201/09618
摘要： A collective lamination substrate N is provided with pattern layers having N number of layers, where N is an integer and 4 or more, a pseudo waveguide formed penetrating through the pattern layers in a lamination direction, a converter section formed in the pattern layers, mutually converting between an electrical signal and radio waves being transmitted and received via the pseudo waveguide, and ground patterns formed in the pattern layers, covering a periphery of a waveguide formation section. The collective lamination substrate further includes: antennas formed in the waveguide formation section; a first via group provided in a periphery of the waveguide formation section; and a second via group provided in a periphery of the waveguide formation section and positioned at a more outer portion than the first via group.
摘要翻译： 集体层叠基板N设置有N层数的图案层，其中N为整数且为4以上，形成在层叠方向上贯穿图案层的伪波导管，形成在图案层中的转换器部分相互 在电信号和经由伪波导发送和接收的无线电波之间进行转换，以及形成在图案层中的覆盖波导形成部分的周边的接地图案。 集体层叠基板还包括：形成在波导形成部中的天线; 设置在波导形成部的周围的第一通孔组; 以及第二通孔组，设置在波导形成部的周边并位于比第一通孔组更外侧的部分。
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公开(公告)号：US20150325925A1
公开(公告)日：2015-11-12
申请号：US14132729
申请日：2013-12-18
CPC分类号： H01L23/66 , H01L21/4853 , H01L21/52 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/19 , H01L24/20 , H01L2223/6622 , H01L2223/6677 , H01L2223/6683 , H01L2224/04105 , H01L2224/12105 , H01L2224/73267 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/18162 , H01L2924/3025 , H01Q1/2283 , H01Q1/38 , H01Q21/0006 , H01Q21/0093 , H01Q23/00
摘要： Embodiments of an embedded mm-wave radio integrated circuit into a substrate of a phased array module are disclosed. In some embodiments, the phased array module includes a first set of substrate layers made of a first material. The mm-wave radio integrated circuit may be embedded in the first set of substrate layers. A second set of substrate layers may be coupled to the first set of substrate layers. The second set of substrate layers may be made of a second material that has a lower electrical loss than the first material. The second set of substrate layers may include a plurality of antenna elements coupled through vias to the mm-wave radio integrated circuit.
摘要翻译： 公开了将嵌入式毫米波无线电集成电路放入相控阵列模块的衬底中的实施例。 在一些实施例中，相控阵列模块包括由第一材料制成的第一组衬底层。 毫米波无线电集成电路可以嵌入在第一组衬底层中。 第二组衬底层可以耦合到第一组衬底层。 第二组衬底层可以由具有比第一材料低的电损耗的第二材料制成。 第二组衬底层可以包括通过通孔耦合到毫米波无线电集成电路的多个天线元件。
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9.发明申请TECHNIQUES FOR OPERATING PHASED ARRAY ANTENNAS IN MILLIMETERWAVE RADIO MODULES 审中-公开在毫米波无线电模块中操作相位阵列天线的技术公开(公告)号：US20140320344A1
公开(公告)日：2014-10-30
申请号：US14325346
申请日：2014-07-07
CPC分类号： H01Q21/0025 , H01Q21/0093 , H01Q21/067 , H01Q21/205 , H01Q23/00
摘要： A method and apparatus for operating a plurality of radiating elements are provided. In one aspect, the method includes measuring a phase and a gain of each of the plurality of radiating elements; determining a feed gain and a feed phase for each of the plurality of radiating elements based on the measured phase and the measured gain of a respective radiating element; and setting independently each of the plurality of radiating elements based on the determined feed gain and the feed phase.
摘要翻译： 提供一种用于操作多个辐射元件的方法和装置。 一方面，该方法包括测量多个辐射元件中的每一个的相位和增益; 基于所测量的相位和相应的辐射元件的所测量的增益来确定所述多个辐射元件中的每一个的馈送增益和馈送相位; 以及基于所确定的进给增益和所述进给相位来独立地设置所述多个辐射元件中的每一个。
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公开(公告)号：US08665174B2
公开(公告)日：2014-03-04
申请号：US13005760
申请日：2011-01-13
申请人： Bradley L. McCarthy
发明人： Bradley L. McCarthy
CPC分类号： H01Q1/28 , H01Q1/42 , H01Q21/0093
摘要： Antenna subassemblies suitable for use in phased array antennas are disclosed, as are phased array antenna assemblies and aircraft comprising phased array antenna assemblies. In one embodiment, an antenna subarray assembly comprises a thermally conductive foam substrate, a plurality of radiating elements bonded to the foam substrate, and a radome disposed adjacent the radiating elements. The subarray assembly presents a triangular shape when viewed in plan view, and the plurality of radiating elements are arranged in a triangular array on the foam substrate. In some embodiments, a plurality of subarray assemblies may be assembled to form an antenna assembly. In further embodiments an aircraft may be fitted with one or more antenna assemblies. Other embodiments may be described.
摘要翻译： 公开了适用于相控阵天线的天线子组件，以及包括相控阵天线组件的相控阵天线组件和飞机。 在一个实施例中，天线子阵列组件包括导热泡沫基底，结合到泡沫基底的多个辐射元件和邻近辐射元件设置的天线罩。 当在平面图中观察时，子阵列呈现三角形形状，并且多个辐射元件以三角形阵列布置在泡沫基底上。 在一些实施例中，可组装多个子阵列组件以形成天线组件。 在另外的实施例中，飞行器可以装配有一个或多个天线组件。 可以描述其他实施例。
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