公开(公告)号：US20180199456A1

公开(公告)日：2018-07-12

申请号：US15741677

申请日：2016-06-08

Applicant: Huawei Technologies Co., Ltd.

Inventor： Kuibing Zhao ,  Wenping Guo ,  Dong Ma ,  Jinhai Guo

IPC: H05K5/03 ,  H05K5/02 ,  B32B5/18 ,  B32B17/06 ,  B32B7/12

CPC classification number: H05K5/03 ,  B32B5/18 ,  B32B7/12 ,  B32B17/064 ,  B32B2255/10 ,  B32B2457/208 ,  G06F1/16 ,  G06F1/1601 ,  G06F1/1626 ,  G06F3/041 ,  G06K9/00006 ,  H04M1/026 ,  H04M1/0266 ,  H05K5/0217 ,  H05K5/0243

Abstract: A component and an electronic device with the component includes a structural assembly and a cover assembly that matches the structural assembly. The structural assembly includes a bracket, the cover assembly includes a cover body, and a glare film is disposed on a surface that is of the cover body and that is close to the structural assembly. An isolation assembly configured to isolate the bracket from the glare film is disposed in some regions between the bracket and the glare film. A hardness of the isolation assembly is less than or equal to hardness of the glare film. A connection assembly configured to connect the bracket and the glare film is disposed in some or all regions that are between the bracket and the glare film and in which the isolation assembly is not disposed.

公开(公告)号：US10159160B2

公开(公告)日：2018-12-18

申请号：US15741677

申请日：2016-06-08

Applicant: Huawei Technologies Co., Ltd.

Inventor： Kuibing Zhao ,  Wenping Guo ,  Dong Ma ,  Jinhai Guo

IPC: H05K7/00 ,  H05K5/00 ,  H05K5/03 ,  G06F1/16 ,  H04M1/02 ,  B32B5/18 ,  B32B7/12 ,  B32B17/06 ,  H05K5/02 ,  G06F3/041 ,  G06K9/00

Abstract: A component and an electronic device with the component includes a structural assembly and a cover assembly that matches the structural assembly. The structural assembly includes a bracket, the cover assembly includes a cover body, and a glare film is disposed on a surface that is of the cover body and that is close to the structural assembly. An isolation assembly configured to isolate the bracket from the glare film is disposed in some regions between the bracket and the glare film. A hardness of the isolation assembly is less than or equal to hardness of the glare film. A connection assembly configured to connect the bracket and the glare film is disposed in some or all regions that are between the bracket and the glare film and in which the isolation assembly is not disposed.

公开(公告)号：US11379000B2

公开(公告)日：2022-07-05

申请号：US16755304

申请日：2017-10-13

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Bangshi Yin ,  Jianhong Luo ,  Shenghui Cao ,  Dong Ma ,  Wenping Guo ,  Yang Guo

IPC: G06F1/16 ,  G06F21/32

Abstract: A structure of an electronic device and an electronic device are disclosed. The structure includes: a cover, a fingerprint decorative component, and a fingerprint sensor. The cover covers a surface of the electronic device, and the cover has a first through hole. The fingerprint decorative component is built in the first through hole, the fingerprint decorative component includes a side wall of the fingerprint decorative component and a bottom wall of the fingerprint decorative component that are integrally connected, the side wall of the fingerprint decorative component is fastened to the cover by using glue. The fingerprint sensor is accommodated in the fingerprint decorative component. The fingerprint decorative component is fastened to the cover by using the glue, and no additional fastening plate and screw is required for fastening, thereby improving overall space utilization of the electronic device.

公开(公告)号：US10904369B2

公开(公告)日：2021-01-26

申请号：US16316242

申请日：2016-07-08

Applicant: Huawei Technologies Co., Ltd.

Inventor： Dong Ma ,  Wenping Guo ,  Jinhai Guo ,  Kuibing Zhao

IPC: H04M1/02

Abstract: A battery cover is applied to the electronic device and configured to couple to a housing of the electronic device, and includes a glass substrate. A non-transparent layer is disposed on a first side of the glass substrate. At least one first through-hole is disposed on the non-transparent layer opposite to a camera assembly disposed in the electronic device. A camera region is disposed on the first side of the glass substrate disposed opposite to the at least one first through-hole. A film-coated layer is disposed in the camera region of the glass substrate. An area of the camera region is greater than or equal to an area of the at least one first through-hole.

公开(公告)号：US20190253539A1

公开(公告)日：2019-08-15

申请号：US16316242

申请日：2016-07-08

Applicant: Huawei Technologies Co., Ltd.

Inventor： Dong Ma ,  Wenping Guo ,  Jinhai Guo ,  Kuibing Zhao

IPC: H04M1/02

CPC classification number: H04M1/0262 ,  H04M1/0264 ,  H04M1/0277 ,  H04M2250/12

Abstract: A battery cover is applied to the electronic device and configured to couple to a housing of the electronic device, and includes a glass substrate. A non-transparent layer is disposed on a first side of the glass substrate. At least one first through-hole is disposed on the non-transparent layer opposite to a camera assembly disposed in the electronic device. A camera region is disposed on the first side of the glass substrate opposite to the at least one first through-hole. A film-coated layer is disposed in the camera region of the glass substrate. An area of the camera region is greater than or equal to an area of the at least one first through-hole.