公开(公告)号：US20240410658A1

公开(公告)日：2024-12-12

申请号：US18810132

申请日：2024-08-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xing Fu ,  Tao Yan ,  Sergey Khairnasov ,  Wenqiang Shi

IPC: F28D15/04

Abstract: A heat pipe includes a pipe body having a sealed cavity. A heat transfer medium and a capillary structure are disposed in the sealed cavity. The pipe body includes a first additional pipe section and a main pipe section including an evaporation section, a heat insulation section, and a condensation section. The first additional pipe section, where a first additional cavity is disposed, is connected to an end part of the evaporation section. The first additional cavity is used to accommodate all or a part of the heat transfer medium when the heat pipe is vertically placed and the first additional pipe section is located below a gravity direction, and when the heat pipe is mounted on a heat dissipation device that requires heat dissipation, the first additional pipe section is not in contact with a heat emitting component of the heat dissipation device.