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1.发明授权公开(公告)号：US11812586B2
公开(公告)日：2023-11-07
申请号：US17508745
申请日：2021-10-22
发明人： Baosheng Li , Tao Yan , Xiaojing Hou , Lujun Zhou , Liang Zhang
IPC分类号： H05K7/20
CPC分类号： H05K7/20736 , H05K7/20745
摘要： An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.
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公开(公告)号：US20230240048A1
公开(公告)日：2023-07-27
申请号：US18184479
申请日：2023-03-15
发明人： Lirui Jia , Chaorong Liu , Peng Jin , Tao Yan
IPC分类号： H05K7/20
CPC分类号： H05K7/2039
摘要： A heat dissipation apparatus is provided. The apparatus includes: a bracket assembly including an accommodation portion used for accommodating a heat source component, a first opening, and a second opening; a heat sink. A heat conducting protrusion is disposed on a first surface of the heat sink, and the heat conducting protrusion extends into the accommodation portion through the second opening; and guide grooves are respectively provided in two side surfaces of the heat sink, and an extension direction of the guide grooves is inclined toward the first surface in an insertion direction of the heat source component; and fastening assemblies, each including a connecting member and a pressing member, where the pressing members are disposed on two sides of the bracket assembly, one end of the connecting member is slidably assembled in a guide groove located on a same side, and the other end abuts against a pressing member.
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3.发明公开公开(公告)号：US20230225075A1
公开(公告)日：2023-07-13
申请号：US18187686
申请日：2023-03-22
发明人： Lujun Zhou , Tao Yan , Guangming Zheng
IPC分类号： H05K7/20
CPC分类号： H05K7/20145
摘要： An air deflection plug-in unit includes a housing and a flow guiding structure. The housing is provided with a first air intake vent and a first air exhaust vent, and there is an included angle between planes on which the first air intake vent and the first air exhaust vent are located. The flow guiding structure is located in the housing. The flow guiding structure is configured to guide an airflow flowing into the first air intake vent to the first air exhaust vent. This disclosure can improve a heat dissipation capability of an electronic component.
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公开(公告)号：US20230328452A1
公开(公告)日：2023-10-12
申请号：US18042758
申请日：2021-08-12
发明人： Jinhua Liu , Tao Yan , Li Guo , Chien Feng Yeh , Ligang Yu
CPC分类号： H04R9/06 , H04R9/025 , H04R9/046 , H05K1/189 , H04R2499/11
摘要： This application provides an electroacoustic transducer and an electronic device, the electroacoustic transducer includes a central magnet, two side magnets, a lower electrode plate, a side electrode plate, a frame, a sound diaphragm, a voice coil, and two flexible circuit boards. The central magnet and the two side magnets are disposed on the lower electrode plate. The side electrode plate is disposed on a surface of the two side magnets which is opposite to the lower electrode plate. Two surfaces of the frame are respectively fixedly connected to the sound diaphragm and a surface of the side electrode plate which is opposite to the lower electrode plate. The voice coil is located inside the frame. The two flexible circuit boards are symmetrically distributed on a peripheral side of the voice coil, two ends of the flexible circuit board are respectively connected to the voice coil and the side electrode plate.
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5.发明申请公开(公告)号：US20220132703A1
公开(公告)日：2022-04-28
申请号：US17508745
申请日：2021-10-22
发明人： Baosheng Li , Tao Yan , Xiaojing Hou , Lujun Zhou , Liang Zhang
IPC分类号： H05K7/20
摘要： An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.
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