公开(公告)号：US12100715B2

公开(公告)日：2024-09-24

申请号：US17158664

申请日：2021-01-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huajun Cao ,  Guozhong Ma ,  Yukun Guo ,  Yong Lu

IPC: H01L27/12 ,  H01L23/10 ,  H01Q1/38 ,  H01Q21/00 ,  G02F1/1368 ,  H01L25/16 ,  H10K59/12

CPC classification number: H01L27/1255 ,  H01L23/10 ,  H01Q21/00 ,  G02F1/1368 ,  H01L25/167 ,  H10K59/12

Abstract: Example array substrates are provided. One example array substrate includes an underlying substrate, an antenna and a component layer, where the antenna and the component layer are located on a same side of the underlying substrate, where the component layer and the antenna are disposed at intervals, where the component layer includes a plurality of metal laminates and a plurality of dielectric laminates that are stacked, and where the plurality of metal laminates and the plurality of dielectric laminates are alternately disposed to form a plurality of thin film transistors.

公开(公告)号：US20190260861A1

公开(公告)日：2019-08-22

申请号：US16343299

申请日：2016-12-13

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xi Wang ,  Jinfeng Zhou ,  Zhengquan Wang ,  Yukun Guo

IPC: H04M1/02 ,  B29C45/14

Abstract: Embodiments include a middle frame for a mobile terminal and a mobile terminal. The middle frame for a mobile terminal includes a metal outer frame. An inner side of the metal outer frame is internally connected to a tray using a location structure. A plastic outer frame is formed on the inner side of the metal outer frame using an insert injection molding process, and the plastic outer frame is separately joined with the metal outer frame and the tray for curing.

公开(公告)号：US10652372B2

公开(公告)日：2020-05-12

申请号：US16343299

申请日：2016-12-13

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xi Wang ,  Jinfeng Zhou ,  Zhengquan Wang ,  Yukun Guo

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H04M1/02 ,  B29C45/14 ,  H04M1/00

Abstract: Embodiments include a middle frame for a mobile terminal and a mobile terminal. The middle frame for a mobile terminal includes a metal outer frame. An inner side of the metal outer frame is internally connected to a tray using a location structure. A plastic outer frame is formed on the inner side of the metal outer frame using an insert injection molding process, and the plastic outer frame is separately joined with the metal outer frame and the tray for curing.