公开(公告)号：US20140116661A1

公开(公告)日：2014-05-01

申请号：US14145490

申请日：2013-12-31

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yan Xu ,  Yunhua Tu

IPC: F28F3/00 ,  B23P15/26

CPC classification number: F28F3/00 ,  B23P15/26 ,  G06F1/20 ,  H01L23/373 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A thermal pad includes: a thermally conductive sheet-like substrate, where the sheet-like substrate has a compressible porous mesh structure in a thickness direction; and a thermally conductive coating, where the coating is formed of a flexible organic compound, and the organic compound fills inside the sheet-like substrate or is coated on a surface of the sheet-like substrate, or the organic compound both fills inside the sheet-like substrate and is coated on the surface of the sheet-like substrate. In the thermal pad, the method for fabricating a thermal pad, the heat dissipating apparatus, and the electronic device provided in the embodiments of the present application, a thermally conductive flexible organic compound fills inside or is coated on a thermally conductive sheet-like substrate having a compressible porous mesh structure in the thickness direction.

Abstract translation: 散热垫包括：导热片状基板，其中片状基板在厚度方向上具有可压缩多孔网状结构; 和导热涂层，其中涂层由柔性有机化合物形成，并且有机化合物填充在片状基材内部或涂覆在片状基材的表面上，或者有机化合物都填充在片材的内部 并且被涂覆在片状基材的表面上。 在本发明的实施方式中，在散热垫，散热装置以及散热装置以及电子装置的制造方法中，导热性柔性有机化合物填充在导热片状基板 在厚度方向上具有可压缩多孔网状结构。