公开(公告)号：US12101906B2

公开(公告)日：2024-09-24

申请号：US15462753

申请日：2017-03-17

申请人： COOLIT SYSTEMS INC.

发明人： Geoff Sean Lyon

IPC分类号： H05K7/20 ,  F28D15/00 ,  F28F3/00 ,  H01L23/473

CPC分类号： H05K7/20 ,  F28D15/00 ,  F28F3/00 ,  H01L23/473 ,  H05K7/20254 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fluid heat exchanger for cooling an electronic device can have a plurality of walls. The walls can define a corresponding plurality of microchannels. Each microchannel can extend from a first end to a second end. The plurality of microchannels can define at least two opposed outer microchannels and a centrally located microchannel positioned between the opposed outer microchannels. A fluid inlet passage can be configured to deliver a heat-exchange fluid to each microchannel between the corresponding first end and the corresponding second end of the respective microchannel. A fluid outlet passage can have an enlarged outlet region from the centrally located microchannel compared to a corresponding outlet region from one or both of the opposed outer microchannels. Related methods are disclosed.

公开(公告)号：US20190219344A1

公开(公告)日：2019-07-18

申请号：US16361655

申请日：2019-03-22

申请人： IHI CORPORATION

发明人： Taiga YAMAMOTO ,  Akihisa YANO ,  Tatsuya OKA ,  Shunji MIYAJIMA ,  Shigeki SAKAKURA ,  Takahito AKITA ,  Hideshi SHIBUYA ,  Yusuke TAKEUCHI

IPC分类号： F28F9/02 ,  F28D9/00

CPC分类号： F28F9/027 ,  B01J19/00 ,  B01J19/24 ,  F28D9/0062 ,  F28D2021/0022 ,  F28F1/00 ,  F28F3/00 ,  F28F19/00

摘要： A heat treatment device causing a first fluid and a second fluid to flow therethrough includes heat transfer bodies including first flow channels through which the first fluid flows and second flow channels through which the second fluid flows adjacent to the first flow channels without contact, and pipe-like members detachably placed in the first flow channels and each including a pipe wall having an outer wall surface conforming to a wall surface defining each first flow channel and an inner wall surface with which the first fluid comes into contact.

公开(公告)号：US20180301391A1

公开(公告)日：2018-10-18

申请号：US15766391

申请日：2016-10-03

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Tomoya Oohiraki ,  Sotaro Oi

IPC分类号： H01L23/373 ,  H01L21/48 ,  F28F3/00 ,  F28F21/08

CPC分类号： H01L23/3735 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/704 ,  C04B2237/706 ,  F28F3/00 ,  F28F21/084 ,  H01L21/4882 ,  H01L25/07 ,  H01L25/18

摘要： Provided is a heat-sink-attached power-module substrate, in which a metal layer and first layers are formed from aluminum sheets having a purity of 99.99 mass % or greater and a heat sink and second layers are formed from aluminum sheets having a purity lower than that of the metal layer and the first layers: when a thickness is t1 (mm), a joined-surface area is A1 (mm2), yield strength at 25° C. is σ11 (N/mm2), yield strength at 200° C. is σ12 (N/mm2) in the second layers; a thickness is t2 (mm), a joined-surface area is A2 (mm2), yield strength at 25° C. is σ21 (N/mm2), and yield strength at 200° C. is σ22 (N/mm2) in the heat sink.

公开(公告)号：US10062465B2

公开(公告)日：2018-08-28

申请号：US15076355

申请日：2016-03-21

申请人： Imatrex Inc.

发明人： Samuel M. Song ,  Junghyun Kwon ,  Jongkyu Lee ,  Douglas P. Boyd

IPC分类号： A61B6/00 ,  G21K1/04 ,  H05K7/20 ,  F28F3/00 ,  A61B6/10 ,  G06F1/20 ,  G06F1/16 ,  H01L23/373 ,  A61B6/03 ,  A61B6/06 ,  A61B8/00

CPC分类号： G21K1/046 ,  A61B6/032 ,  A61B6/06 ,  A61B6/10 ,  A61B6/4028 ,  A61B6/4085 ,  A61B8/54 ,  F28F3/00 ,  G06F1/1656 ,  G06F1/20 ,  H01L23/373 ,  H01L23/3733 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K7/2039 ,  Y10T428/2848 ,  H01L2924/00

摘要： A computed tomography (CT) apparatus to perform a CT scan with a reduced radiation, including: an X-ray source to direct a cone beam of X-rays toward a detector assembly with an object of interest situated between the source and the detector assembly; a multi-leaf collimator fixed with respect to the X-ray source and configured to dynamically limit the cone beam of X-rays directed toward the object of interest, the multi-leaf collimator comprising a plurality of leaflets to block impinging cone beam of X-rays; and the detector assembly to detect the directed X-ray beam on a side opposite to the X-ray source after the X-ray beam with the reduced solid angle passes through the object of interest.

公开(公告)号：US20180094883A1

公开(公告)日：2018-04-05

申请号：US15721220

申请日：2017-09-29

申请人： Bosal Emission Control Systems NV

发明人： Yves DE VOS

IPC分类号： F28F21/08 ,  F28F3/00

CPC分类号： F28F21/089 ,  B01D53/14 ,  B01D53/64 ,  B01D2253/104 ,  B01D2253/1124 ,  B01D2255/20707 ,  B01D2257/60 ,  B01D2258/0208 ,  B32B15/015 ,  C22C19/05 ,  C22C38/18 ,  F28D2021/0043 ,  F28F3/00 ,  F28F19/06 ,  F28F2245/06 ,  H01M8/04022 ,  H01M8/04074

摘要： A high temperature plate heat exchanger with low chromium rejection for fluids above 550° C. and a method of cooling a gas is suggested. The heat exchanger comprises a plurality of heat transfer plates made of a chromium-containing alloy, particularly high-temperature stainless steel or Ni-based chromium-containing alloy and having two heat transfer surfaces. The plurality of heat transfer plates comprise at least on one heat transfer surface of the heat transfer plates a chromium absorber coating comprising porous titanium dioxide over at least a first portion of the length of said heat transfer surface. The chromium absorber coatings of two adjacent heat transfer plates are facing each other.

公开(公告)号：US20170324132A1

公开(公告)日：2017-11-09

申请号：US15587802

申请日：2017-05-05

申请人： Dana Canada Corporation

发明人： Benjamin A. Kenney ,  Joseph A. Kamenski

IPC分类号： H01M10/6556 ,  H01M10/625 ,  H01M2/10

CPC分类号： H01M10/6556 ,  F28F3/00 ,  F28F3/046 ,  F28F3/12 ,  F28F9/0248 ,  F28F27/02 ,  F28F2250/06 ,  H01M2/1094 ,  H01M10/625 ,  H01M2220/20

摘要： A heat exchanger for battery thermal management applications is disclosed. The heat exchanger has at least one internal, two-pass flow passage, the at least one internal, two-pass flow passage having an inlet end and an outlet end and at least a first flow passage portion and at least a second flow passage portion interconnected by a generally U-shaped turn portion. An inlet manifold is in fluid communication with the inlet end of the internal flow passage for delivering an incoming fluid stream to the heat exchanger while an outlet manifold is in fluid communication with the outlet end of the internal flow passage for discharging an outgoing fluid stream from the heat exchanger. A bypass passage fluidly interconnects the incoming fluid stream and the outgoing fluid stream.

公开(公告)号：US09797661B1

公开(公告)日：2017-10-24

申请号：US14042039

申请日：2013-09-30

申请人： HRL LABORATORIES, LLC

发明人： Christopher S. Roper ,  Alan J. Jacobsen

IPC分类号： F28D15/04 ,  B23P15/26 ,  F28F3/00

CPC分类号： F28D15/04 ,  B23P15/26 ,  F28D15/046 ,  F28F3/00 ,  F28F21/06 ,  F28F2260/00 ,  H05K7/20336 ,  Y10T29/49353

摘要： A method for creating a sandwich panel heat pipe is disclosed. A three-dimensional ordered micro-truss core comprising a plurality of periodically disposed unit cells comprising an open-cellular microstructure and a free space defined by the open-cellular microstructure wherein the core comprises a vapor region and a liquid region separated by a mesh structure. A first face sheet and a second face sheet are stacked with the three-dimensional ordered micro-truss core to form a heat pipe assembly with the mesh structure in the three-dimensional ordered micro-truss core being planar and substantially parallel to the first face sheet and the second face sheet. The first and second face sheets are bonded to enclose the three-dimensional ordered micro-truss core wherein the free space of the three-dimensional ordered micro-truss core between the first and second face sheets is filled with a working fluid through an inlet and the inlet is sealed.

公开(公告)号：US09623520B2

公开(公告)日：2017-04-18

申请号：US14105691

申请日：2013-12-13

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： B23P15/26 ,  H05K7/20 ,  G06F1/20 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  F28D15/02

CPC分类号： B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

摘要： A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

公开(公告)号：US20170011935A1

公开(公告)日：2017-01-12

申请号：US15276444

申请日：2016-09-26

申请人： FUJI ELECTRIC CO., LTD.

发明人： Yoshinori UEZATO ,  Masayuki SOUTOME ,  Rikihiro MARUYAMA ,  Tomoaki GOTO

IPC分类号： H01L21/48 ,  H01L23/367 ,  B23P15/26

CPC分类号： H01L21/4882 ,  B23P15/26 ,  F28F3/00 ,  H01L21/4803 ,  H01L21/4878 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  Y10T29/49366 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor module radiator plate fabrication method includes soldering a plurality of insulating substrates of different shapes to a flat radiator plate, and forming a convex curve on an insulating substrate side of the radiator plate; obtaining a first concave curve by reversing the convex curve; setting a second concave curve on an insulating substrate side of a radiator plate after soldering, a bottom of the second concave curve being positioned under clearance between the plurality of insulating substrates; adding the first curve and the second curve to calculate a third concave curve on the insulating substrate side; and forming the third curve on a flat plate to form a radiator plate before soldering.

摘要翻译： 半导体模块散热板制造方法包括将多个不同形状的绝缘基板焊接到平坦散热板，并在散热板的绝缘基板侧形成凸曲线; 通过反转凸曲线获得第一凹曲线; 在焊接之后在散热板的绝缘基板侧设置第二凹曲线，所述第二凹曲线的底部位于所述多个绝缘基板之间的间隙处; 添加第一曲线和第二曲线以计算绝缘基板侧上的第三凹曲线; 并在平板上形成第三曲线以在焊接之前形成散热板。

公开(公告)号：US09516782B2

公开(公告)日：2016-12-06

申请号：US14110269

申请日：2012-03-27

申请人： Alfred Fuchs

发明人： Alfred Fuchs

IPC分类号： H05K7/20 ,  G06F1/20 ,  F28F3/00

CPC分类号： H05K7/20136 ,  F28F3/00 ,  G06F1/20 ,  H05K7/20563

摘要： Components and/or assemblies are applied on a substrate. The substrate has a populating side and a heat sink side, to which a heat sink is fitted. The populating side is provided with a cover, which together with a heat sink on the heat sink side of the substrate forms a type of housing for the populated substrate. Between substrate and heat sink, a guide channel for a cooling medium (e.g. air, etc.) is provided and the substrate has an opening. A fan is fitted above the opening in such a way that a cooling flow of the cooling medium generated by the fan is conducted through the guide channel on the heat sink side of the substrate and over the populating side of the substrate and thus over the mounted components and/or assemblies. The heated cooling medium is then conducted away with the aid of the cover.

摘要翻译： 组件和/或组件被施加在衬底上。 衬底具有装配侧和散热器侧，散热器安装在该侧。 填充侧设置有盖，其与衬底的散热器侧上的散热器一起形成用于填充衬底的一种类型的壳体。 在衬底和散热器之间，提供用于冷却介质（例如空气等）的引导通道，并且衬底具有开口。 风扇安装在开口上方，使得由风扇产生的冷却介质的冷却流通过衬底的散热器侧的引导通道并且在衬底的填充侧上并且因此被安装 组件和/或组件。 然后借助于盖子将加热的冷却介质导出。