公开(公告)号：US20140069611A1

公开(公告)日：2014-03-13

申请号：US14081288

申请日：2013-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhenzhen Liu ,  Xiaojing Hou ,  Shanjiu Chi

IPC: H01L23/367 ,  H01L23/40

CPC classification number: H01L23/3672 ,  H01L23/36 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the present invention provide a heat dissipater and relate to the communications field. The heat dissipater includes a sub heat dissipater, a connecting apparatus, and a shared bracket; the sub heat dissipater is connected to the shared bracket through the connecting apparatus; the sub heat dissipater includes a first heat conducting surface, and the sub heat dissipater contacts a first heat source through the first heat conducting surface to dissipate heat for the first heat source; the shared bracket includes a second heat conducting surface, and the shared bracket contacts a second heat source through the second heat conducting surface to dissipate heat for the second heat source; and the second heat conducting surface and the sub heat dissipater are disposed in different positions of the shared bracket respectively.

Abstract translation: 本发明的实施例提供一种散热器并且涉及通信领域。 散热器包括副散热器，连接装置和共用支架; 辅助散热器通过连接装置连接到共享支架; 副散热器包括第一导热表面，并且副散热器通过第一导热表面接触第一热源以散热第一热源; 所述共用支架包括第二导热表面，并且所述共享支架通过所述第二导热表面接触第二热源以散热用于所述第二热源; 并且第二导热面和副散热器分别设置在共享支架的不同位置。

公开(公告)号：US09917029B2

公开(公告)日：2018-03-13

申请号：US14081288

申请日：2013-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhenzhen Liu ,  Xiaojing Hou ,  Shanjiu Chi

IPC: F28F7/00 ,  H01L23/367 ,  H01L23/36 ,  H01L23/40 ,  H01L23/427

CPC classification number: H01L23/3672 ,  H01L23/36 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the present invention provide a heat dissipater and relate to the communications field. The heat dissipater includes a sub heat dissipater, a connecting apparatus, and a shared bracket; the sub heat dissipater is connected to the shared bracket through the connecting apparatus; the sub heat dissipater includes a first heat conducting surface, and the sub heat dissipater contacts a first heat source through the first heat conducting surface to dissipate heat for the first heat source; the shared bracket includes a second heat conducting surface, and the shared bracket contacts a second heat source through the second heat conducting surface to dissipate heat for the second heat source; and the second heat conducting surface and the sub heat dissipater are disposed in different positions of the shared bracket respectively.