摘要:
A dynamic random access memory cell having vertical channel transistor includes a semiconductor pillar, a drain layer, an assisted gate, a control gate, a source layer, and a capacitor. The vertical channel transistor has an active region formed by the semiconductor pillar. The drain layer is formed at the bottom of the semiconductor pillar. The assisted gate is formed beside the drain layer, and separated from the drain layer by a first gate dielectric layer. The control gate is formed beside the semiconductor pillar, and separated from the active region by a second gate dielectric layer. The source layer is formed at the top of the semiconductor pillar. The capacitor is formed to electrical connect to the source layer.
摘要:
A dynamic random access memory cell having vertical channel transistor includes a semiconductor pillar, a drain layer, an assisted gate, a control gate, a source layer, and a capacitor. The vertical channel transistor has an active region formed by the semiconductor pillar. The drain layer is formed at the bottom of the semiconductor pillar. The assisted gate is formed beside the drain layer, and separated from the drain layer by a first gate dielectric layer. The control gate is formed beside the semiconductor pillar, and separated from the active region by a second gate dielectric layer. The source layer is formed at the top of the semiconductor pillar. The capacitor is formed to electrical connect to the source layer.
摘要:
A vertical capacitor-less DRAM cell is described, including: a source layer having a first conductivity type, a storage layer disposed on the source layer and having a second conductivity type, an active layer disposed on the storage layer and having the first conductivity type, a drain layer disposed on the active layer and having the second conductivity type, an address gate disposed beside the active layer and separated from the same by a first gate dielectric layer, and a storage gate disposed beside the storage layer and separated from the same by a second gate dielectric layer. The DRAM cell can be written by turning on the MOSFET formed by the storage layer, the active layer, the drain layer, the first gate dielectric layer and the address gate to inject carriers into the storage layer from the active layer.
摘要:
A vertical capacitor-less DRAM cell is described, including: a source layer having a first conductivity type, a storage layer disposed on the source layer and having a second conductivity type, an active layer disposed on the storage layer and having the first conductivity type, a drain layer disposed on the active layer and having the second conductivity type, an address gate disposed beside the active layer and separated from the same by a first gate dielectric layer, and a storage gate disposed beside the storage layer and separated from the same by a second gate dielectric layer. The DRAM cell can be written by turning on the MOSFET formed by the storage layer, the active layer, the drain layer, the first gate dielectric layer and the address gate to inject carriers into the storage layer from the active layer.
摘要:
A video compact disk storage rack including a first end member, a second end member, an open frame connected between the first end member and the second end member at the top, two connecting rods bilaterally connected between the first end member and the second end member at the bottom, two expansion springs mounted inside the open frame at two opposite sides, and two T-blocks respectively supported on the expansion springs and moved along two longitudinal sliding slots on the open frame at two opposite sides for holding down video compact disks within the open frame.
摘要:
A compact disk assembly rack structure includes two elongated strips, a lower frame, two rods, two support frames and an upper frame as well as a multiplicity of screws. Each of the strips have an upper groove for receiving a longer side of the lower frame which is squeezed through a gap into a circular portion below to be positioned therein. A rod is then fitted into the upper groove of the strip. The support frames each have a clamp for fastening onto a corresponding narrow portion of a shorter side of the lower frame. The upper frame has flat surfaces formed at two shorter sides thereof corresponding to flat surfaces formed at the top of the support frames. Each of the shorter sides of the upper frame is fastened to each of the support frames by screws passing through the flat surfaces of the upper frame into the flat surfaces of the support frames. A number of compact disk racks may be placed one on top of the other for storage or transportation. The compact disk assembly rack may be partly assembled so that the support frames may be folded inwardly to rest in the hollow space of the lower frame, while the upper frame is placed horizontally around the lower frame, achieving the purposes of saving space in storage and transportation.
摘要:
A process for fabricating a sharp corner-free shallow trench isolation structure. First, a SiON layer and a mask layer are successively formed on a semiconductor substrate. The SiON layer and mask layer are patterned to form an opening, exposing the substrate region on which a shallow trench isolation region will be formed. Next, an oxide spacer is formed on sidewalls of the SiON layer and mask layer. A trench is formed in the semiconductor substrate using the spacer and mask layer as a mask. Next, a liner oxide layer is formed on the surface of the trench by thermal oxidation, such that the liner oxide layer near the SiON layer is in a bird's beak form. An isolating oxide layer is filled in the trench. Finally, the mask layer and SiON layer are removed. The present invention forms a short and thick bird's beak structure and rounded trench corner. Therefore, the thickness of the tunnel oxide is even and the tunnel oxide integrity remains. Thus, the electric current is not accumulated on the trench corner, and parasitic transistors and current leakage can be prevented.