FINFET AND METHOD OF FABRICATING THE SAME
    1.
    发明申请
    FINFET AND METHOD OF FABRICATING THE SAME 有权
    FINFET及其制造方法

    公开(公告)号:US20120091538A1

    公开(公告)日:2012-04-19

    申请号:US12903712

    申请日:2010-10-13

    IPC分类号: H01L29/78 H01L21/311

    摘要: The disclosure relates to a fin field effect transistor (FinFET). An exemplary structure for a FinFET comprises a substrate comprising a top surface; a first insulation region and a second insulation region over the substrate top surface comprising tapered top surfaces; a fin of the substrate extending above the substrate top surface between the first and second insulation regions, wherein the fin comprises a recessed portion having a top surface lower than the tapered top surfaces of the first and second insulation regions, wherein the fin comprises a non-recessed portion having a top surface higher than the tapered top surfaces; and a gate stack over the non-recessed portion of the fin.

    摘要翻译: 本发明涉及鳍状场效应晶体管(FinFET)。 FinFET的示例性结构包括:包括顶表面的衬底; 第一绝缘区域和位于衬底顶表面上的第二绝缘区域,包括锥形顶表面; 在所述第一和第二绝缘区域之间延伸到所述衬底顶表面之上的所述衬底的翅片,其中所述鳍片包括具有比所述第一和第二绝缘区域的锥形顶表面低的顶表面的凹陷部分,其中所述鳍片包括非 加工部分具有高于锥形顶表面的顶表面; 以及在翅片的非凹陷部分上方的栅极堆叠。