Solder alloy
    1.
    发明授权
    Solder alloy 失效
    焊锡合金

    公开(公告)号:US6033488A

    公开(公告)日:2000-03-07

    申请号:US961021

    申请日:1997-10-30

    CPC分类号: C22C13/02 B23K35/262

    摘要: A solder alloy includes tin (Sn) of 50-80 wt %, antimony (Sb) of 0.05-10 wt %, silver (Ag) of 0.0001-5 wt %, phosphorus (P) of 0.0001-0.5 wt %, unavoidable impurities, and lead for the remaining wt %. Numerical limitation to the content amount of the respective elements and the rest effects the solder alloy to have an improved fatigue-proof characteristic for a soldering area.

    摘要翻译: 焊料合金包括50-80重量%的锡(Sn),0.05-10重量%的锑(Sb),0.0001-5重量%的银(Ag),0.0001-0.5重量%的磷(P),不可避免的杂质 ,并导致剩余的wt%。 对各元素的含量的数量限制和其余的影响焊接合金对于焊接区域具有改进的耐疲劳特性。