公开(公告)号：US20100099357A1

公开(公告)日：2010-04-22

申请号：US12582310

申请日：2009-10-20

申请人： I-Ru Liu ,  Ting-I Tsai ,  Wen-Pin Lo ,  Tung-Kai Chang ,  Hsiao-Chien Chou ,  Ming-Yi Shen

发明人： I-Ru Liu ,  Ting-I Tsai ,  Wen-Pin Lo ,  Tung-Kai Chang ,  Hsiao-Chien Chou ,  Ming-Yi Shen

IPC分类号： H04B7/00 ,  H04M1/00

CPC分类号： H04B1/3805 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/66 ,  H01L25/0657 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wireless transceiver module has a plurality of through holes and includes a wireless network chip, a circuit substrate, a Bluetooth chip, and a plurality of conductive connection structures. The Bluetooth chip is disposed between the circuit substrate and the wireless network chip, and the through holes are formed by passing through the wireless network chip, the circuit substrate, and the Bluetooth chip. The conductive connection structures are respectively disposed in the through hole. With the conductive connection structures, the Bluetooth chip, the wireless network chip, and the circuit substrate are electrically connected with each another.

摘要翻译： 无线收发器模块具有多个通孔，并且包括无线网络芯片，电路基板，蓝牙芯片和多个导电连接结构。 蓝牙芯片设置在电路基板和无线网络芯片之间，通孔通过无线网络芯片，电路基板和蓝牙芯片形成。 导电连接结构分别设置在通孔中。 利用导电连接结构，蓝牙芯片，无线网络芯片和电路基板彼此电连接。

公开(公告)号：US08478197B2

公开(公告)日：2013-07-02

申请号：US12582310

申请日：2009-10-20

申请人： I-Ru Liu ,  Ting-I Tsai ,  Wen-Pin Lo ,  Tung-Kai Chang ,  Hsiao-Chien Chou ,  Ming-Yi Shen

发明人： I-Ru Liu ,  Ting-I Tsai ,  Wen-Pin Lo ,  Tung-Kai Chang ,  Hsiao-Chien Chou ,  Ming-Yi Shen

IPC分类号： H04B7/00

CPC分类号： H04B1/3805 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/66 ,  H01L25/0657 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wireless transceiver module has a plurality of through holes and includes a wireless network chip, a circuit substrate, a Bluetooth chip, and a plurality of conductive connection structures. The Bluetooth chip is disposed between the circuit substrate and the wireless network chip, and the through holes are formed by passing through the wireless network chip, the circuit substrate, and the Bluetooth chip. The conductive connection structures are respectively disposed in the through hole. With the conductive connection structures, the Bluetooth chip, the wireless network chip, and the circuit substrate are electrically connected with each another.

摘要翻译： 无线收发器模块具有多个通孔，并且包括无线网络芯片，电路基板，蓝牙芯片和多个导电连接结构。 蓝牙芯片设置在电路基板和无线网络芯片之间，通孔通过无线网络芯片，电路基板和蓝牙芯片形成。 导电连接结构分别设置在通孔中。 利用导电连接结构，蓝牙芯片，无线网络芯片和电路基板彼此电连接。