公开(公告)号：US20220015234A1

公开(公告)日：2022-01-13

申请号：US17359805

申请日：2021-06-28

Applicant: IBIDEN CO., LTD.

Inventor： Isao OHNO ,  Tomoya DAIZO ,  Yoji SAWADA ,  Kazuhiko KURANOBU

IPC: H05K1/11 ,  H05K1/09 ,  H01L23/498 ,  H01L23/00

Abstract: A wiring substrate includes a resin insulating layer, a conductor pad formed on the resin insulating layer, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post connected to the conductor pad and protruding from the coating insulating layer such that a gap is formed between the metal post and the conductor pad at a peripheral edge of the metal post. The coating insulating layer is formed such that the coating insulating layer has an interposed portion formed in the gap between the metal post and the conductor pad at the peripheral edge of the metal post.

公开(公告)号：US20220013455A1

公开(公告)日：2022-01-13

申请号：US17361460

申请日：2021-06-29

Applicant: IBIDEN CO., LTD.

Inventor： Isao OHNO ,  Tomoya DAIZO ,  Yoji SAWADA ,  Kazuhiko KURANOBU

IPC: H01L23/522 ,  H01L23/00 ,  H01L21/768

Abstract: A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The via conductor is formed such that the via conductor is increased in diameter toward the conductor pad, and the metal post is formed such that the metal post is increased in diameter toward the conductor pad.

公开(公告)号：US20220013409A1

公开(公告)日：2022-01-13

申请号：US17361522

申请日：2021-06-29

Applicant: IBIDEN CO., LTD.

Inventor： Isao OHNO ,  Tomoya DAIZO ,  Yoji SAWADA ,  Kazuhiko KURANOBU

IPC: H01L21/768

Abstract: A method for manufacturing a wiring substrate includes forming multiple conductor pads on an insulating layer such that the conductor pads include multiple first conductor pads and multiple second conductor pads, forming multiple protruding parts on surfaces of the first conductor pads of the conductor pads, respectively, forming a resin layer such that the resin layer covers the insulating layer and the conductor pads, exposing, from the resin layer, end portions of the protruding parts on the opposite side with respect to the insulating layer, forming, in the resin layer, multiple openings such that the openings expose surfaces of the second conductor pads of the conductor pads, respectively; and forming a coating film on the surfaces of the second conductor pads exposed in the openings.

公开(公告)号：US20220013448A1

公开(公告)日：2022-01-13

申请号：US17359887

申请日：2021-06-28

Applicant: IBIDEN CO., LTD.

Inventor： Isao OHNO ,  Tomoya DAIZO ,  Yoji SAWADA ,  Kazuhiko KURANOBU

IPC: H01L23/498 ,  H01L21/48

Abstract: A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The conductor pad is formed such that a central axis of the conductor pad is shifted in a predetermined direction with respect to a central axis of the via conductor, and the metal post is formed such that a central axis of the metal post is shifted in the predetermined direction with respect to the central axis of the conductor pad.