公开(公告)号：US20220015234A1

公开(公告)日：2022-01-13

申请号：US17359805

申请日：2021-06-28

Applicant: IBIDEN CO., LTD.

Inventor： Isao OHNO ,  Tomoya DAIZO ,  Yoji SAWADA ,  Kazuhiko KURANOBU

IPC: H05K1/11 ,  H05K1/09 ,  H01L23/498 ,  H01L23/00

Abstract: A wiring substrate includes a resin insulating layer, a conductor pad formed on the resin insulating layer, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post connected to the conductor pad and protruding from the coating insulating layer such that a gap is formed between the metal post and the conductor pad at a peripheral edge of the metal post. The coating insulating layer is formed such that the coating insulating layer has an interposed portion formed in the gap between the metal post and the conductor pad at the peripheral edge of the metal post.

公开(公告)号：US20200335257A1

公开(公告)日：2020-10-22

申请号：US16847748

申请日：2020-04-14

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki KODAMA ,  Kazuro NISHIWAKI ,  Kazuhiko KURANOBU ,  Hiroaki UNO

IPC: H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H05K1/16

Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings of the core substrate, and through-hole conductors formed through the core substrate such that each of the through-hole conductors includes a metal film. The magnetic resin has through holes formed through the magnetic resin such that the through-hole conductors include a group of through-hole conductors formed in the through holes formed through the magnetic resin, and the magnetic resin includes an iron oxide filler in an amount of 60% by weight or more.

公开(公告)号：US20220013448A1

公开(公告)日：2022-01-13

申请号：US17359887

申请日：2021-06-28

Applicant: IBIDEN CO., LTD.

Inventor： Isao OHNO ,  Tomoya DAIZO ,  Yoji SAWADA ,  Kazuhiko KURANOBU

IPC: H01L23/498 ,  H01L21/48

Abstract: A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The conductor pad is formed such that a central axis of the conductor pad is shifted in a predetermined direction with respect to a central axis of the via conductor, and the metal post is formed such that a central axis of the metal post is shifted in the predetermined direction with respect to the central axis of the conductor pad.

公开(公告)号：US20220013455A1

公开(公告)日：2022-01-13

申请号：US17361460

申请日：2021-06-29

Applicant: IBIDEN CO., LTD.

Inventor： Isao OHNO ,  Tomoya DAIZO ,  Yoji SAWADA ,  Kazuhiko KURANOBU

IPC: H01L23/522 ,  H01L23/00 ,  H01L21/768

Abstract: A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The via conductor is formed such that the via conductor is increased in diameter toward the conductor pad, and the metal post is formed such that the metal post is increased in diameter toward the conductor pad.

公开(公告)号：US20220013409A1

公开(公告)日：2022-01-13

申请号：US17361522

申请日：2021-06-29

Applicant: IBIDEN CO., LTD.

Inventor： Isao OHNO ,  Tomoya DAIZO ,  Yoji SAWADA ,  Kazuhiko KURANOBU

IPC: H01L21/768

Abstract: A method for manufacturing a wiring substrate includes forming multiple conductor pads on an insulating layer such that the conductor pads include multiple first conductor pads and multiple second conductor pads, forming multiple protruding parts on surfaces of the first conductor pads of the conductor pads, respectively, forming a resin layer such that the resin layer covers the insulating layer and the conductor pads, exposing, from the resin layer, end portions of the protruding parts on the opposite side with respect to the insulating layer, forming, in the resin layer, multiple openings such that the openings expose surfaces of the second conductor pads of the conductor pads, respectively; and forming a coating film on the surfaces of the second conductor pads exposed in the openings.

公开(公告)号：US20210257224A1

公开(公告)日：2021-08-19

申请号：US17159619

申请日：2021-01-27

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiko KURANOBU ,  Tomoya DAIZO

IPC: H01L21/48 ,  H01L23/498

Abstract: A manufacturing method of a wiring substrate includes forming an interlayer insulating layer on a substrate, forming a metal film on a surface of the insulating layer such that the metal film covers the surface of the insulating layer, etching a surface of the metal film on the opposite side with respect to the insulating layer such that the surface of the metal film is roughened, forming a dry film on the roughened surface of the metal film such that the dry film has an opening formed in the dry film, forming an electrolytic plating film in the opening using the metal film as a power feeding layer, removing the dry film from the metal film, and removing part of the metal film exposed from the plating film by the dry film removing such that the part of the metal film is removed from the surface of the insulating layer.

公开(公告)号：US20200335259A1

公开(公告)日：2020-10-22

申请号：US16855108

申请日：2020-04-22

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki KODAMA ,  Kazuro NISHIWAKI ,  Kazuhiko KURANOBU ,  Hiroaki UNO

IPC: H01F27/28 ,  H01L23/498 ,  H01L23/552 ,  H01F41/04 ,  H01L21/48

Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings and having through holes, and through-hole conductors formed in the through holes respectively such that each of the through-hole conductors includes a metal film. The magnetic resin is formed such that each of the through holes has an angle part having an obtuse angle formed by an upper surface of the magnetic resin and a side wall of a respective one of the through holes.