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公开(公告)号：US11363714B2
公开(公告)日：2022-06-14
申请号：US17030947
申请日：2020-09-24
申请人： IBIDEN CO., LTD.
发明人： Akinori Yoshida , Katsuhiko Tanno
摘要： A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and including conductor pads, an underlayer formed on one of the conductor pads of the conductor layer and including a metal different from a metal of the conductor layer, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and has openings exposing the conductor pads, respectively, and a bump formed directly on a first conductor pad of the conductor pads and including a base plating layer formed in a first opening of the openings and a top plating layer formed on the base plating layer such that a metal of the base plating layer is same as the metal of the conductor layer.
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公开(公告)号：US11729911B2
公开(公告)日：2023-08-15
申请号：US17674038
申请日：2022-02-17
申请人： IBIDEN CO., LTD.
发明人： Akinori Yoshida , Katsuhiko Tanno
CPC分类号： H05K1/111 , H05K3/34 , H05K3/4007 , H05K3/4605
摘要： A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including conductor pads, an underlayer formed on one of the conductor pads and including a metal different from a metal of the conductor layer, a solder resist layer formed on the base layer such that the solder resist layer is covering the conductor layer and has openings exposing the conductor pads, and a bump formed directly on a first conductor pad of the conductor pads and including a base plating layer formed in a first opening of the openings and a top plating layer formed on the base plating layer such that a metal of the base plating layer is same as the metal of the conductor layer. The conductor pads include a second conductor pad such that the second conductor pad is the one of the conductor pads having the underlayer.
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