公开(公告)号：US20220346240A1

公开(公告)日：2022-10-27

申请号：US17723638

申请日：2022-04-19

申请人： IBIDEN CO., LTD.

发明人： Keisuke SHIMIZU ,  Kohei SUZUKI

IPC分类号： H05K3/46 ,  H05K3/00 ,  H05K3/28 ,  H05K3/40 ,  C25D5/02 ,  C25D7/00 ,  C23C28/00 ,  C23C18/16

摘要： A method for manufacturing a wiring substrate includes forming a conductor layer including first and second pads, forming a resin insulating layer on the conductor layer, forming, in the insulating layer, a first opening exposing the first pad and a second opening exposing the second pad, forming a covering layer on the insulating layer such that the covering layer covers the first and second openings, forming a third opening in the covering layer such that the third opening communicates with the first opening and the first pad is exposed in the third opening, forming, on a surface of the first pad, a protective film formed of material different from material forming the conductor layer, removing the covering layer from the insulating layer, and forming a conductor post on the second pad such that the conductor post is formed of material that is same as the material forming the conductor layer.