公开(公告)号：US20140118976A1

公开(公告)日：2014-05-01

申请号：US14067080

申请日：2013-10-30

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Liyi CHEN ,  Toshiki FURUTANI

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/30

CPC classification number: H05K3/4644 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L2924/0002 ,  H01L2924/3511 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate having opening, an electronic component device accommodated in the opening of the substrate and including inductor and passive components, a wiring structure connecting the inductor and passive components in the electronic device, a filler resin body filling space formed between the substrate and electronic device in the opening of the substrate, a first buildup layer including a first interlayer insulation layer on first surface of the substrate, a first conductive layer on the first insulation layer, and a first via conductor in the first insulation layer, and a second buildup layer including a second interlayer insulation layer on second surface of the substrate on the opposite side of the first surface of the substrate, a second conductive layer on the second insulation layer, and a second via conductor in the second insulation layer.

Abstract translation: 印刷电路板包括具有开口的芯基板，容纳在基板的开口中并包括电感器和无源部件的电子部件装置，连接电子装置中的电感器和无源部件的布线结构，填充树脂体填充空间 在衬底和电子器件之间的衬底的开口中的第一堆积层，在衬底的第一表面上包括第一层间绝缘层，第一绝缘层上的第一导电层和第一绝缘层中的第一通孔导体 以及第二累积层，其在基板的第一表面的相反侧的第二表面上包括第二层间绝缘层，第二绝缘层上的第二导电层和第二绝缘层中的第二通孔导体 。