公开(公告)号：US20160042861A1

公开(公告)日：2016-02-11

申请号：US14820666

申请日：2015-08-07

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko MANO ,  Toshihiko ONOGI ,  Kazuhiro YOSHIKAWA ,  Yuki TANAKA ,  Haruhiko MORITA ,  Takashi KARIYA

IPC: H01F27/28 ,  H01F27/245

CPC classification number: H01F27/2804 ,  H01F27/245 ,  H01F2027/2809

Abstract: A printed wiring board includes a core substrate having a cavity, an inductor component positioned in the cavity of the substrate, a first buildup layer formed on first surface of the substrate, and a second buildup layer formed on second surface of the substrate. The inductor component includes an insulating layer having first openings and a second opening formed between the first openings, conductive through holes formed in the first openings, respectively, a magnetic body formed in the second opening, a first interconnect formed on first surface of the insulating layer and connecting the conductive through holes on the first surface of the insulating layer, and a second interconnect formed on second surface of the insulating layer and connecting the conductive through holes on the second surface of the insulating layer, and the first interconnect, second interconnect and conductive through holes are positioned to form a spiral structure.

Abstract translation: 印刷布线板包括具有空腔的芯基板，位于基板的空腔中的电感器部件，形成在基板的第一表面上的第一累积层和形成在基板的第二表面上的第二累积层。 电感器部件包括具有第一开口的绝缘层和形成在第一开口之间的第二开口，分别形成在第一开口中的导电通孔，形成在第二开口中的磁体，形成在绝缘体的第一表面上的第一互连 并且连接绝缘层的第一表面上的导电通孔，以及形成在绝缘层的第二表面上并连接绝缘层的第二表面上的导电通孔的第二互连和第一互连，第二互连 并且导电通孔被定位成形成螺旋结构。