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1.Method of forming tunneling junctions for intermetallic semiconductor devices 失效
Title translation: 形成金属间半导体器件的隧道结的方法公开(公告)号:US3355335A
公开(公告)日:1967-11-28
申请号:US40224864
申请日:1964-10-07
Applicant: IBM
Inventor: BUTLER JAMES H , CHANCE DUDLEY A , IM SAMUEL S
CPC classification number: H01L23/291 , H01L21/00 , H01L29/00 , H01L2924/0002 , Y10S148/071 , Y10S148/107 , Y10S148/152 , Y10S438/979 , H01L2924/00
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2.Circuit package with improved modular assembly and cooling apparatus 失效
Title translation: 具有改进的模块化组件和冷却装置的电路组件公开(公告)号:US3365620A
公开(公告)日:1968-01-23
申请号:US55708666
申请日:1966-06-13
Applicant: IBM
Inventor: BUTLER JAMES H , IM SAMUEL S , PALFI THOMAS L
IPC: H01L23/473 , H05K7/20
CPC classification number: H01L23/473 , H01L2924/0002 , H01L2924/15312 , H01L2924/3011 , H05K7/20 , H01L2924/00
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3.Process of making tunnel diodes that results in a peak current that is maintained over a long period of time 失效
Title translation: 制造隧道二极管的过程导致长时间保持的峰值电流公开(公告)号:US3291658A
公开(公告)日:1966-12-13
申请号:US29143063
申请日:1963-06-28
Applicant: IBM
Inventor: BUTLER JAMES H , DE WITT DAVID
IPC: H01L21/00 , H01L21/3063 , H01L29/00
CPC classification number: H01L21/00 , H01L21/3063 , H01L29/00 , Y10S438/979
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