公开(公告)号：US3372378A

公开(公告)日：1968-03-05

申请号：US36271064

申请日：1964-04-27

Applicant: IBM

Inventor： DEVORE ERNEST W ,  SMITH ROY J ,  TYRRELL JOHN M

IPC: G06F3/06 ,  G06F9/32

CPC classification number: G06F9/30094 ,  G06F3/06 ,  G06F3/0601 ,  G06F9/30058 ,  G06F2003/0698

公开(公告)号：US3643135A

公开(公告)日：1972-02-15

申请号：US3643135D

申请日：1970-06-29

Applicant: IBM

Inventor： DEVORE ERNEST W ,  HOTALING KENNETH L

IPC: H05K1/14 ,  H05K7/02 ,  H02B1/02

CPC classification number: H05K1/144 ,  H05K7/023

Abstract: An electronic circuit module and resulting array, each module having an insulating support body with first, second and third electrical conductive means extending through the body along three mutually perpendicular axes. The plugs and receptacles of the respective conductive means are arranged to provide orientation of the module such that when a plurality of modules are connected together, appropriate circuit connections are made. A recess in each of the modules provides vertical cooling chimneys in the array. The array may be arranged such that one module in each of the cooling chimneys is activated at a given time to minimize the heat accumulation. The triaxially extending electrical conductive means also carries heat toward the array surface to further limit temperature rise within the array.

Abstract translation: 电子电路模块和所得阵列，每个模块具有绝缘支撑体，其具有沿着三个相互垂直的轴线延伸穿过主体的第一，第二和第三导电装置。 各个导电装置的插头和插座被布置成提供模块的取向，使得当多个模块连接在一起时，进行适当的电路连接。 每个模块中的凹槽提供阵列中的垂直冷却烟囱。 该阵列可以被布置成使得每个冷却烟囱中的一个模块在给定时间被激活以最小化热积聚。 三轴延伸的导电装置还向阵列表面承载热量以进一步限制阵列内的温度升高。