公开(公告)号：US3573973A

公开(公告)日：1971-04-06

申请号：US3573973D

申请日：1967-11-13

Applicant: IBM

Inventor： DROTAR JOHN S ,  PARKER ARDEN A ,  SNYDER KEITH A

IPC: C23C18/28 ,  H05K3/18 ,  H05K3/34 ,  H05K3/38 ,  H05K1/00

CPC classification number: C23C18/285 ,  H05K3/184 ,  H05K3/3468 ,  H05K3/38 ,  H05K2201/0129 ,  H05K2203/044 ,  H05K2203/0723 ,  H05K2203/1105 ,  H05K2203/1407

Abstract: A HIGH SPEED ADDITIVE CIRCUIT PROCESS FOR MANUFACTURE OF CIRCUIT LINES UPON A POLYESTER OR POLYIMIDE SUBSTRATE, INCLUDING THROUGH-HOLES THEREIN, COMPRISING THE STEPS OF CLEANING, SENSITIZING, ACTIVATING, PRINTING A NEGATIVE FACSIMILE, OF THE FINAL DESIRED PATTERN OVER THE ACTIVATED SURFACE, HEAT SETTING, ELECTROLESS NICKEL PLATING, CURING, AND FINAL CONDUCTIVE COATING BY FLOW SOLDERING. ONLY ONE STEP MAY EXCEED ONE MINUTE IN TIME. TEMPERATURES AND TIME AT TEMPERATURE DETAILS ARE INCLUDED. CONDUCTIVE LINES AS FINE AS 2 MILS WIDE ON 4 MIL CENTERS MAY BE MADE BY THIS PROCESS.