公开(公告)号：US3669665A

公开(公告)日：1972-06-13

申请号：US3669665D

申请日：1971-02-18

Applicant: IBM

Inventor： FAIGENBAUM MARK A ,  LASKY DANIEL J ,  WEISEL HAROLD C

IPC: G03C1/74 ,  G03F1/08 ,  G03C5/00

CPC classification number: G03C1/74

Abstract: THE SEPARABLE LAYERS OF A PHOTOGRAPHIC STRIPPING FILM. CONSISTING OF A COMPOSITE OF A LAYER OF SENSITIVE UNEXPOSED EMULSION (E.G. SILVER HALIDE) CARRIED UPON A PERMANENT SUPPORT LAYER (E.G. CELLULOSE NITRATE) AND STRIPPED FROM THE TEMPORARY SUPPORT LAYER AND SMOOTHLY ADHERED TO AN OBJECT SURFACE WITH THE PERMANENT SUPPORT LAYER ADJACENT THE SURFACE. THE EMULSION LAYER SUCCESSIVELY RECEIVES IMAGE-WISE EXPOSURE TO LIGHT IN A FAST EXPOSURE PROCESS, PHOTOGRAPHIC DEVELOPMENT AND RELIEF DEVELOPMENT; THE LAST BY AN ETCH-BLEACH PROCESS. THE UNDERLYING SUPPORT LAYER IS DISSOLVED IMAGE-WISE WITH HIGH-FIDELITY THROUGH THE RELIEF STENCIL IN THE EMULSION LAYER. EXPOSED AREAS OF THE OBJECT SURFACE THEN RECEIVE AQUEOUS BASED PROCESS HANDLING (E.G. ETCHING OR PLATING) THROUGH THE AQUEOUS RESISTANT COMPOSITE MASTER STENCIL FORMED BY THE EMULSION AND SUPPORT LAYERS.

公开(公告)号：US3645873A

公开(公告)日：1972-02-29

申请号：US3645873D

申请日：1969-06-30

Applicant: IBM

Inventor： CORNISH BLAIR E ,  DAMM EUGENE P JR ,  FAIGENBAUM MARK A

IPC: C25D13/04 ,  C25D15/00 ,  B01K5/02 ,  C23B13/00

CPC classification number: C25D15/00 ,  C25D13/04

Abstract: INSULATIVE FILM COATINGS FORMED UPON SEPARATED METAL WIRES BY ELECTROPHORETIC DEPOSITION FROM AQUEOUS POLYMER LATEX DISPERSIONS ARE FOUND TO BE CONJOINABLE INTO SUPPORTING STRUCTURES WHICH ARE THICK BY COMPARISON TO DIAMETERS OF ENCLOSED WIRES AND WHICH HAVE PRE-DETERMINABLE DIMENSIONAL PROPERTIES WHEN SOLIDIFIED. ELECTRICAL SIGNAL TRANSMISSION LINES ARE MADE AT REDUCED COST BY THIS PROCESS. WIRES IN SUCH LINES ARE HELD CLOSE TOGETHER WITHOUT TOUCHING AT SPACING DISTANCES HELD TO TIGHT TOLERANCES. THE ELECTROPHORETICALLY APPLIED INSULATING-SUPPORTING STRUC-

TURE OF THESE LINES CAN BE PROVIDED WITH SUCH OTHER DESIRABLE FEATURES AS INTERNAL CONTINUITY (I.E. CRACKFREE, VOID-FREE), THERMAL STABILITY, ABRASION RESISTANCE, HIGH DIELECTRIC STRENGTH, FLEXIBILITY, AND UNIFORM COHESION TO THE SUPPORTED WIRES.