公开(公告)号：US3876389A

公开(公告)日：1975-04-08

申请号：US28902172

申请日：1972-09-14

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN ,  FREEDMAN JAMES F ,  KOVAC ZLATA

IPC: B29C70/14 ,  B29C70/62 ,  C22C32/00 ,  C22C47/00 ,  B32B15/08 ,  B32B15/02

CPC classification number: B29C70/62 ,  B29C70/14 ,  C22C32/00 ,  C22C47/00 ,  C25D3/16 ,  C25D3/18 ,  C25D15/00 ,  Y10S428/902 ,  Y10S428/935 ,  Y10T428/12444 ,  Y10T428/12569 ,  Y10T428/12889 ,  Y10T428/12944 ,  Y10T428/294 ,  Y10T428/31522

Abstract: A composite material is provided by this disclosure which utilizes prior art host matrix materials with new resident inclusions for structural members with unique properties and applications. An illustrative embodiment of a composite material according to the principles of this invention is described with fiber inclusions fabricated by electroplating of a polycrystalline film on a substrate. Polycrystalline fibers are fabricated with a wide range of sizes to have strength approaching those of a single crystal whisker of the polycrystalline material. An illustrative composite material is fabricated with a host matrix of epoxy resin in which resident fiber inclusions are dispersed.