摘要:
A composite plated product has a metal material and a plating film of compounded carbon nanomaterials and microparticles coated on the metal material in a nickel plating bath in which carbon nanomaterials are mixed together with microparticles having an average grain size of 2.5 μm or less.
摘要:
There is provided a rare-earth permanent magnet optimized to an IPM type motor for a car, capable of improving corrosion resistance, abrasion resistance, and impact resistance. The rare-earth permanent magnet 16 is configured by forming an electroplated Ni coating film 21, of which thickness is 15 μm or more and 30 μm or less and of which shape is a columnar crystal structure, on a surface of a R—Fe—B system permanent magnet (R is a rare-earth element) 22. The electroplated Ni coating film 21 has a high hardness region, where the Vickers hardness is 300 or more and 600 or less, and a low hardness region, where the Vickers hardness is 150 or more and 300 or less. The rare-earth permanent magnet 16 is used in a state where the rare-earth permanent magnet 16 is inserted into a slot of a yoke in a rotor of an IPM type motor for a car.
摘要:
Production of oxyalkylated acetylenic alcohols by reaction of acetylenic alcohols with alkylene oxides in the presence of phosphines, polar aprotic solvents or thioethers.
摘要:
A composite material is provided by this disclosure which utilizes prior art host matrix materials with new resident inclusions for structural members with unique properties and applications. An illustrative embodiment of a composite material according to the principles of this invention is described with fiber inclusions fabricated by electroplating of a polycrystalline film on a substrate. Polycrystalline fibers are fabricated with a wide range of sizes to have strength approaching those of a single crystal whisker of the polycrystalline material. An illustrative composite material is fabricated with a host matrix of epoxy resin in which resident fiber inclusions are dispersed.
摘要:
THIS INVENTION COMPRISES AN IMPROVEMENT IN A BRIGHT NICKEL PLATING BATH IN WHICH PREVIOUSLY TROUBLESOME PLATING AT CURRENT DESITIES OF LESS THAN 8 A.S.F. OR EVEN UNDER 15 A.S.F. IS AVOIDED BY USING A COMBINATION OF ADDITIVES COMPRISING (A) A SULFO-OXYGEN CONTROL AGENT, (B) A NITROGEN-CONTAINING BRIGHTENER, NAMELY AN AROMATIC MONOAMINE OR AROMATIC POLYAMINE, AN UNSUBSTITUTED POLYETHYLENEPOLYAMINE OR A NITRILE, AND (C) FROM 0.0005 TO 0.1 GRAM PER LITER OF AN ACETYLENIC ALCOHOL HAVING THE FORMULA HC$C-R IN WHICH R IS A HYDROXY-SUBSTITUTED HYDROCARBON RADICAL HAVING 1-8 CARBON ATOMS THEREIN SELECTED FROM THE CLASS CONSISTING OF HYDROXY-SUBSTITUTED ALKYL, ALKENYL AND CYCLOALKYL GROUPS AND THE ALKYLENE OXIDE ADDUCTS THEREOF CONTAINING NO MORE THAN 4 ALKYLENE OXIDE GROUPS AND THE ALKYLENE GROUP THEREIN HAVING 1-4 CARBON ATOMS.
摘要:
The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr layer containing 10-100 μg/dm2 of Cr is provided.
摘要:
The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr layer containing 10-100 μg/dm2 of Cr is provided.
摘要:
Provided is a printed circuit board for a memory card and a method of manufacturing the same, the printed circuit board for the memory card, including: an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.