公开(公告)号：US3614677A

公开(公告)日：1971-10-19

申请号：US3614677D

申请日：1966-04-29

Applicant: IBM

Inventor： WILFINGER RAYMOND J

IPC: H01L27/00 ,  H01L27/20 ,  H01L29/00 ,  H03H9/24 ,  H03H9/46 ,  H03H9/04

CPC classification number: H03H9/46 ,  H01L27/00 ,  H01L27/20 ,  H01L29/00 ,  H03H9/24

Abstract: A semiconductor substrate is supported so as to allow mechanical vibration of the substrate. This semiconductor substrate is of a size and has such electrical and mechanical characteristics as to be capable of sustaining mechanical stress and producing a useable resonance frequency. An excitation element is formed in the substrate at a suitable location to cause mechanical strain in the semiconductor substrate by a thermal expansion mechanism. The further addition of a device formed in the semiconductor substrate for converting mechanical stresses in the semiconductor substrate into electrical phenomena makes the semiconductor device of even greater value.

公开(公告)号：US3417249A

公开(公告)日：1968-12-17

申请号：US33441963

申请日：1963-12-30

Applicant: IBM

Inventor： AKMENKALNS IVARS G ,  WILFINGER RAYMOND J ,  WILSON ALAN D

IPC: H01L31/173 ,  H03K17/94

CPC classification number: H01L31/173 ,  H03K17/941