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公开(公告)号:US20210375668A1
公开(公告)日:2021-12-02
申请号:US17329556
申请日:2021-05-25
Applicant: IMEC VZW
Inventor: Didit Yudistira , Alexey Milenin
IPC: H01L21/762 , H01L21/306 , H01L21/3065 , H01L23/00
Abstract: A Silicon on Insulator (SOI) structure and a method for creating an undercut (UCUT) in an SOI structure, in particular, for a 300 mm SOI platform, is provided. In particular, the method includes fabricating one or more cavities in a silicon substrate underneath an insulator layer of the SOI structure by performing a first dry etch of the silicon substrate to create the one or more cavities, performing a first wet etch of the silicon substrate to expand the one or more cavities, performing a second dry etch of the silicon substrate to further expand the one or more cavities and to break silicon facets created by the first wet etch, and performing a second wet etch to further expand the one or more cavities.
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公开(公告)号:US11556043B2
公开(公告)日:2023-01-17
申请号:US17348049
申请日:2021-06-15
Applicant: IMEC VZW
Inventor: Younghyun Kim , Didit Yudistira , Bernardette Kunert , Joris Van Campenhout , Maria Ioanna Pantouvaki
Abstract: A monolithic integrated electro-optical phase modulator, a Mach-Zehnder modulator including one or more of the phase modulators, and method for fabricating the phase modulator by III-V-on-silicon semiconductor processing are provided. The phase modulator includes a silicon-based n-type substrate base layer, and a III-V n-type ridge waveguide for propagating light, wherein the ridge waveguide protrudes from and extends along the n-type substrate base layer. Further, the phase modulator includes one or more insulating layers provided on the ridge waveguide, wherein the one or more insulating layers have together a thickness of 1-100 nm, and a silicon-based p-type top cover layer provided on the one or more insulating layers at least above the ridge waveguide.
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公开(公告)号:US20220011641A1
公开(公告)日:2022-01-13
申请号:US17348049
申请日:2021-06-15
Applicant: IMEC VZW
Inventor: Younghyun Kim , Didit Yudistira , Bernardette Kunert , Joris Van Campenhout , Maria Ioanna Pantouvaki
Abstract: A monolithic integrated electro-optical phase modulator, a Mach-Zehnder modulator including one or more of the phase modulators, and method for fabricating the phase modulator by III-V-on-silicon semiconductor processing are provided. The phase modulator includes a silicon-based n-type substrate base layer, and a III-V n-type ridge waveguide for propagating light, wherein the ridge waveguide protrudes from and extends along the n-type substrate base layer. Further, the phase modulator includes one or more insulating layers provided on the ridge waveguide, wherein the one or more insulating layers have together a thickness of 1-100 nm, and a silicon-based p-type top cover layer provided on the one or more insulating layers at least above the ridge waveguide.
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