公开(公告)号：US20030057548A1

公开(公告)日：2003-03-27

申请号：US10290722

申请日：2002-11-08

Applicant: INCEP Technologies, Inc.

Inventor： David H. Hartke ,  Joseph Ted Dibene II ,  Edward J. Derian ,  James M. Broder

IPC: H01L023/34

CPC classification number: G06F1/20 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/206 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K7/1092 ,  H01L2924/00

Abstract: The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.

Abstract translation: 本发明被描述为集成电子组件。 电子组件包括散热装置，功率调节电路板，安装在基板上的功率耗散装置和电力互连组件。 功率调节电路板包括热耦合到散热装置的第一侧，用于产生经调节的电力信号的功率调节电路和孔。 功率耗散装置具有通过孔热耦合到散热装置的顶表面。 衬底包括靠近衬底的至少一个边缘布置的至少一个电源导体。 将经调节的功率信号电耦合到基板并且向基板提供基本上所有功率的功率互连组件包括可移除地耦合到基板的至少一个边缘的边缘连接器组件。