公开(公告)号：US20140174505A1

公开(公告)日：2014-06-26

申请号：US13866260

申请日：2013-04-19

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hsin-Hsin Hsieh ,  Jang-Hsing Hsieh ,  Chi-Shiung Hsi

IPC: H01L31/048 ,  H01L31/18

CPC classification number: H01L31/048 ,  H01L31/0481 ,  H01L31/0516 ,  Y02E10/50

Abstract: The disclosure provides a solar cell encapsulating module including a first substrate, a first encapsulating material layer, a metal particle layer, multiple solar cells, a routing layer, a second encapsulating material layer and a second substrate. The first substrate is formed from a light transmittance material. The first encapsulating material layer is formed on the first substrate. The metal particle layer is formed on the first encapsulating material layer. The solar cells are disposed on the metal particle layer. The routing layer is disposed on the solar cells for being electrically connected to the plurality of solar cells. The second encapsulating material layer is formed on the routing layer. The second substrate is disposed on the second encapsulating material layer. The routing layer is disposed on only one side of the solar cells.

Abstract translation: 本发明提供了一种太阳能电池封装模块，包括第一基板，第一封装材料层，金属颗粒层，多个太阳能电池，布线层，第二封装材料层和第二基板。 第一基板由透光材料形成。 第一封装材料层形成在第一衬底上。 金属颗粒层形成在第一包封材料层上。 太阳能电池被设置在金属颗粒层上。 布线层设置在太阳能电池上，用于电连接到多个太阳能电池。 第二封装材料层形成在布线层上。 第二基板设置在第二封装材料层上。 路由层仅设置在太阳能电池的一侧。

公开(公告)号：US09722115B2

公开(公告)日：2017-08-01

申请号：US13866260

申请日：2013-04-19

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hsin-Hsin Hsieh ,  Jang-Hsing Hsieh ,  Chi-Shiung Hsi

IPC: H01L31/048 ,  H01L31/05

CPC classification number: H01L31/048 ,  H01L31/0481 ,  H01L31/0516 ,  Y02E10/50

Abstract: The disclosure provides a solar cell encapsulating module including a first substrate, a first encapsulating material layer, a metal particle layer, multiple solar cells, a routing layer, a second encapsulating material layer and a second substrate. The first substrate is formed from a light transmittance material. The first encapsulating material layer is formed on the first substrate. The metal particle layer is formed on the first encapsulating material layer. The solar cells are disposed on the metal particle layer. The routing layer is disposed on the solar cells for being electrically connected to the plurality of solar cells. The second encapsulating material layer is formed on the routing layer. The second substrate is disposed on the second encapsulating material layer. The routing layer is disposed on only one side of the solar cells.