公开(公告)号：US20200063282A1

公开(公告)日：2020-02-27

申请号：US16447358

申请日：2019-06-20

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chien-Hsun CHU ,  Chien-Chou TSENG ,  Ming-Huan YANG ,  Tai-Jui WANG ,  Yu-Hua CHUNG ,  Chieh-Wei FENG

IPC: C25D5/02 ,  H01L21/288 ,  H01L23/528 ,  C25D7/12

Abstract: A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.