公开(公告)号：US20250141568A1

公开(公告)日：2025-05-01

申请号：US18519054

申请日：2023-11-26

Applicant: Industrial Technology Research Institute

Inventor： Huan-Ta Chen

IPC: H04B17/12 ,  H04B7/0426 ,  H04B17/13

Abstract: A beamforming chip and a radio frequency signal calibration method are provided. The beamforming chip includes a plurality of phase and gain controlling circuits and a calibration circuit. Each phase and gain controlling circuit is configured to change a phase and an amplitude of a received radio frequency input signal to generate a coupling signal. The calibration circuit is coupled to each phase and gain controlling circuit, and configured to select two of the coupling signals, wherein one is a first selected coupling signal before calibration and another one is a second selected coupling signal before calibration. The calibration takes the first selected coupling signal as a reference target to calibrate the phase and the amplitude gain of the second selected coupling signal until there are a minimum phase difference and a closest amplitude between the second selected coupling signal and the reference target.

公开(公告)号：US20250055190A1

公开(公告)日：2025-02-13

申请号：US18468779

申请日：2023-09-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ching-Wen CHIANG ,  Huan-Ta Chen ,  Chung-Lien Ho ,  Chin Pin Chen

IPC: H01Q5/40 ,  H01Q1/22

Abstract: An antenna-in-package construction includes a chip layer, a second dielectric layer, and a first dielectric layer stacked in order. The first dielectric layer has a dielectric constant more than 3.5. The antenna-in-package construction includes a transmitting antenna array, a receiving antenna array, and metal isolated pillars. The transmitting antenna array extends from the chip layer to the first dielectric layer through the second dielectric layer. The receiving antenna array extends from the chip layer to the second dielectric layer. The transmitting antenna array and the receiving antenna array are arranged in an alternating interleaved sequence. The metal isolated pillars surround each transmitting antenna and each receiving antenna. The chip layer includes at least one transmitting chip and at least one receiving chip. The transmitting chip and the receiving chip are electrically connected to the transmitting antenna array and the receiving antenna array, respectively.