公开(公告)号：US20150293624A1

公开(公告)日：2015-10-15

申请号：US14586447

申请日：2014-12-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Sin-An CHEN ,  Chih-Chia CHANG ,  Sheng-Wei CHEN

IPC: G06F3/044 ,  H05K1/02

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04111 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K1/0298

Abstract: A touch panel may include a substrate, a touch unit region and a covering layer. The touch unit region includes first electrode and a second electrode isolated from the first electrode. The covering layer covers at least one of the first electrode and the second electrode and has a touch surface. A distance between the touch surface and the first electrode or the second electrode ranges between 0.01 micrometers and 100 micrometers. A mutual capacitance value between the first electrode and the second electrode ranges between 0.1 pF and 10 pF when a touch has not occurred yet.

Abstract translation: 触摸面板可以包括基板，触摸单元区域和覆盖层。 触摸单元区域包括与第一电极隔离的第一电极和第二电极。 覆盖层覆盖第一电极和第二电极中的至少一个并且具有触摸表面。 触摸表面和第一电极或第二电极之间的距离在0.01微米和100微米之间。 当没有发生触摸时，第一电极和第二电极之间的互电容值在0.1pF至10pF之间。

公开(公告)号：US20160266670A1

公开(公告)日：2016-09-15

申请号：US14803875

申请日：2015-07-20

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Sin-An CHEN ,  Chih-Chia CHANG

IPC: G06F3/041

CPC classification number: G06F3/044 ,  G06F3/0412

Abstract: A touch device is provided. The touch device includes a first insulating layer, a first sensing electrode layer, a second insulating layer, and a second sensing electrode layer. The first sensing electrode layer is located on the first insulating layer. The second insulating layer is located on the first sensing electrode layer. The second sensing electrode layer is located on the second insulating layer.

Abstract translation: 提供触摸装置。 触摸装置包括第一绝缘层，第一感测电极层，第二绝缘层和第二感测电极层。 第一感测电极层位于第一绝缘层上。 第二绝缘层位于第一感测电极层上。 第二感测电极层位于第二绝缘层上。

公开(公告)号：US20150307732A1

公开(公告)日：2015-10-29

申请号：US14534233

申请日：2014-11-06

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Sheng-Wei CHEN ,  Sin-An CHEN ,  Chuan-Hsu FU ,  Li-Ching WANG ,  Yi-Ling CHEN

IPC: C09D133/08 ,  C09D133/14

CPC classification number: C09D133/14 ,  C08L2312/00 ,  C09D133/06

Abstract: According to embodiments of the disclosure, a substrate structure, a method for manufacturing the substrate structure, and a method for manufacturing an electronic device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer contacts the carrier, wherein there is a first adhesion force between the de-bonding layer and the carrier. The de-bonding layer is prepared from a composition, and the composition includes at least one acrylate-based monomer and at least one acrylate-based oligomer, wherein the sum of acrylate group of the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3. The flexible substrate covers and contacts the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate. The second adhesion force is greater than the first adhesion force.

Abstract translation: 根据本公开的实施例，公开了一种基板结构，用于制造基板结构的方法以及一种用于制造电子器件的方法。 衬底结构包括载体，去粘合层和柔性衬底。 载体具有顶面。 脱粘合层与载体接触，其中在去结合层和载体之间存在第一粘附力。 去结合层由组合物制备，组合物包含至少一种丙烯酸酯类单体和至少一种丙烯酸酯类低聚物，其中丙烯酸酯类单体和丙烯酸酯类低聚物的丙烯酸酯基总量为 大于或等于3.柔性衬底覆盖并接触去粘合层，其中在去粘合层和柔性衬底之间存在第二粘附力。 第二粘附力大于第一粘附力。