公开(公告)号：US20200163175A1

公开(公告)日：2020-05-21

申请号：US16234338

申请日：2018-12-27

Applicant: Industrial Technology Research Institute

Inventor： Chia-Ching HUANG ,  Yueh-Lin TSAI ,  Ping-Hsun WU ,  Jui-Hung CHEN

IPC: H05B6/72 ,  H05B6/64

Abstract: A microwave heating device is configured to heat an object. The microwave heating device includes a heating chamber, a first frequency selective plate, a second frequency selective plate, a first microwave source, and a second microwave source. The first frequency selective plate is disposed in the heating chamber. The second frequency selective plate is disposed in the heating chamber. A microwave heating space is formed between the first frequency selective plate and the second frequency selective plate. The first microwave source is disposed outside of the microwave heating space, and configured to emit a first microwave toward the first frequency selective plate. The second microwave source is disposed outside of the microwave heating space, and configured to emit a second microwave toward the second frequency selective plate.

公开(公告)号：US20220190475A1

公开(公告)日：2022-06-16

申请号：US17135538

申请日：2020-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Joseph Poujiong WANG ,  Chia Ching HUANG ,  Wei-Ji CHEN ,  Yueh-Lin TSAI

IPC: H01Q3/38 ,  H01Q3/28 ,  H01Q3/26

Abstract: A frequency reconfigurable phased array system comprises a signal generator outputting a power signal with an adjustable frequency, a plurality of radio frequency (RF) modules receiving the power signal, a control module generating excitation mode parameter sets and material processing event sets, a first database storing the excitation mode parameter sets, and a second database storing the material processing event sets. The control module generates a material processing schedule by selecting one of the material processing event sets based on a material recipe, an average power, and a total time of a material, and controls a signal frequency of the signal generator according to the material processing schedule and the excitation mode parameter sets, and a RF phase and a RF power of each of the RF modules, to have the RF modules generating a power signal.

公开(公告)号：US20230143739A1

公开(公告)日：2023-05-11

申请号：US17553500

申请日：2021-12-16

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ruey-Bing HWANG ,  Yueh-Lin TSAI

IPC: H01Q3/26 ,  H01Q21/22 ,  H01Q3/30

CPC classification number: H01Q3/267 ,  H01Q21/22 ,  H01Q3/30

Abstract: An antenna array calibration device and method thereof are provided. The method includes measuring the power total of the antenna array, controlling active components to adjust the antennas to having a maximum amplitude, controlling phase shifters to adjust the antennas to having a random phase, calculating the phase difference between an initial phase and a random phase, calculating the amplitude difference between an initial amplitude and the maximum amplitude, introducing the phase difference, the amplitude difference and the power total of the antenna array into a simultaneous equation of amplitudes and phases to obtain the initial amplitude and the initial phase of the antennas, and adjusting the phase of the antenna array if there is a real number solution of the equation, or otherwise adjusting the phase of the antenna array to another random phase to obtain a real number solution of the equation.

公开(公告)号：US20220209379A1

公开(公告)日：2022-06-30

申请号：US17135492

申请日：2020-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yueh-Lin TSAI

IPC: H01P1/18

Abstract: A phase control structure includes a metal electrode plate, a stub portion, a switch and a ground plate. The metal electrode plate includes a first surface and a second surface, and one end of the stub portion is connected to the second surface. The metal electrode plate and the ground plate are disposed on a top surface and a bottom surface of a substrate, respectively. The substrate is disposed with a via hole. The second surface of the metal electrode plate contacts the top surface of the substrate. The stub portion is disposed in the via hole without contacting the ground plate. One end of the switch is connected to another end of the stub portion, and the ground plate is connected to another end of the switch. The switch is configured to receive a control signal to be one of an on state and an off state.