公开(公告)号：US20190287875A1

公开(公告)日：2019-09-19

申请号：US16431808

申请日：2019-06-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Heinrich Koerner ,  Michael Bauer ,  Reimund ENGL ,  Michael Huettinger ,  Werner Kanert ,  Joachim Mahler ,  Brigitte Ruehle

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/495

Abstract: In various embodiments, methods for forming a chip package are provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.

公开(公告)号：US20170338165A1

公开(公告)日：2017-11-23

申请号：US15600843

申请日：2017-05-22

Applicant: Infineon Technologies AG

Inventor： Heinrich KOERNER ,  Michael BAUER ,  Reimund ENGL ,  Michael HUETTINGER ,  Werner KANERT ,  Joachim MAHLER ,  Brigitte RUEHLE

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/532 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L23/293 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/495 ,  H01L23/49582 ,  H01L23/53228 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/186 ,  H01L2924/365 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/45664 ,  H01L2224/45644 ,  H01L2924/01046 ,  H01L2924/00015 ,  H01L2224/45669

Abstract: In various embodiments, a chip package is provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.